SN74AUC1G86
SINGLE 2-INPUT EXCLUSIVE-OR GATE
www.ti.com
SCES389H – MARCH 2002 – REVISED JUNE 2006
FEATURES
•
•
•
•
•
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Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
Ioff Supports Partial Power-Down-Mode
Operation
Sub-1-V Operable
Max tpd of 2.5 ns at 1.8 V
Low Power Consumption, 10-µA Max ICC
DBV PACKAGE
(TOP VIEW)
A
1
5
•
A
VCC
1
3
4
3
5
VCC
GND
3 4
B
4
1 5
Y
2
A
2
GND
2
GND
YEA OR YZA PACKAGE
(BOTTOM VIEW)
DCK PACKAGE
(TOP VIEW)
B
B
±8-mA Output Drive at 1.8 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
VCC
Y
Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This single 2-input exclusive-OR gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V
to 1.95-V VCC operation.
The SN74AUC1G86 performs the Boolean function Y = A ⊕ B or Y = AB + AB in positive logic.
A common application is as a true/complement element. If the input is low, the other input is reproduced in true
form at the output. If the input is high, the signal on the other input is reproduced inverted at the output.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE (1)
NanoStar™
WCSP (DSBGA) – YEA
ORDERABLE PART NUMBER
TOP-SIDE MARKING (2)
(2)
NanoFree™
Reel of 3000
WCSP (DSBGA) – YZA (Pb-free)
SN74AUC1G86YZAR
Reel of 3000
SN74AUC1G86DBVR
U86_
SOT (SC-70) – DCK
(1)
SN74AUC1G86YEAR
SOT (SOT-23) – DBV
–40°C to 85°C
Reel of 3000
Reel of 3000
SN74AUC1G86DCKR
UH_
_ _ _UH_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2006, Texas Instruments Incorporated
