BurrĆBrown Products
from Texas Instruments
TLV5610IYZ
SBAS389A – JULY 2006 – REVISED JULY 2006
2.7V to 5.5V, 12-Bit, Octal
DIGITAL-TO-ANALOG CONVERTER
in a Wafer Chip-Scale Package—Pb-Free/Green
FEATURES
APPLICATIONS
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Eight, 12-Bit, Voltage Output DACs in One
Package
Pin-Compatible, Pb-Free, RoHS-Compliant
Upgrade to the TLV5610IYE
Programmable Settling Time versus Power
Consumption:
– 1µs in Fast Mode
– 3µs in Slow Mode
Compatible With TMS320™ DSP Family and
SPI™ Serial Ports
Differential and Single-Ended Analog
Input/Output
Separate Software Control for ADC and DAC
Power Down
Monotonic Over Temperature
Low Power Consumption:
– 18mW in Slow Mode at 3V
– 48mW in Fast Mode at 3V
Power Down Mode
Buffered, High-Impedance Reference Inputs
Data Output for Daisy-Chaining
Digital Servo-Control Loops
Digital Offset and Gain Adjustment
Industrial Process Control
Machine and Motion Control Devices
Mass Storage Devices
WAFER CHIP-SCALE PACKAGE
(BOTTOM VIEW)
LDAC
MODE
OUTD
REF
18 17 16
DOUT
15
14
20
13
19
DVDD
OUTB
OUTC
12
DGND
34
56
FS
SCLK
OUTH
78
OUTE
PRE
AGND
9
2
AVDD
10
1
DIN
OUTA
11
OUTG
OUTF
DESCRIPTION
The TLV5610IYZ is the lead-free version of the TLV5610IYE, an eight-channel, 12-bit, voltage output
digital-to-analog converter (DAC) with a flexible serial interface. The serial interface allows glueless interface to
TMS320 and SPI, QSPI™, and Microwire™ serial ports. It is programmed with a 16-bit serial string containing
four control and 12 data bits.
Additional features include a power-down mode, an LDAC input for simultaneous update of all eight DAC
outputs, and a data output that can be used to cascade multiple devices.
The resistor string output voltage is buffered by a rail-to-rail output amplifier with a programmable settling time to
allow the designer to optimize speed versus power dissipation. The buffered, high-impedance reference input
can be connected to the supply voltage.
The TLV5610IYZ is implemented in a CMOS process and is available in a 20-terminal wafer chip-scale package
(WCSP). The TLV5610IYZ is characterized for operation from –40°C to +85°C in a wire-bonded small outline
(SO) package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TMS320 is a trademark of Texas Instruments, Inc.
SPI, QSPI are trademarks of Motorola, Inc.
Microwire is a trademark of National Semiconductor Corp.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
