F-215 (Rev 14AUG15)
QTH–090–01–C–D–A
®
QTH–030–01–L–D–A
QTH–060–07–F–D–A
(0.50 mm) .0197"
QTH SERIES
HIGH SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTH
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating: Au or Sn over
50µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(1 pin powered per row)
Ground Plane:
25 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC (5 mm Stack Height)
Max Cycles: 100
RoHS Compliant: Yes
Processing:
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (030-060)
(0.15 mm) .006" max (090)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
Integral metal plane for
power or ground
Board Mates:
QSH
Standard Stack Heights
from 5 mm to 25 mm
Cable Mates:
HQCD, HQDP
(See Also Available note)
100 GbE ™
ort
yper transp
H
XAUI ®
s
PCI Expres
SATA ™
InfiniBand
notes at
Download app ppnote
mtec.com/a
www.sa
@ samtec.com
Contact SIG
on protocols
for questions
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
Single-Ended Signaling
–D
9 GHz / 18 Gbps
9.5 GHz / 19 Gbps
Differential Pair Signaling
–D
8 GHz / 16 Gbps 10.5 GHz / 21 Gbps
Differential Pair Signaling
–DP 9.5 GHz / 19 Gbps 16.5 GHz / 33 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QTH or contact sig@samtec.com
QTH/QSH
5 mm Stack Height
Type
LEAD
STYLE
PINS PER ROW
NO. OF PAIRS
QTH
Specify
LEAD
STYLE
from
chart
RECOGNITIONS
–030, –060, –090
For complete scope
of recognitions see
www.samtec.com/quality
(60 total pins per bank = –D)
–020, –040, –060
(20 pairs per bank = –D–DP)
PLATING
OPTION
–D
= Gold Flash on
Signal Pins and
Ground Plane,
Matte Tin on tails
= Single-Ended
= 10µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–D = (No. of Pins per Row/30) x (20.00) .7875
(MOQ Required)
–DP = (No. of Pairs per Row/20) x (20.00) .7875
(20.00) .7875
01
–C*
(7.11)
.280
02
(0.50)
.0197
(0.20)
.008
A
A
–01 & –02
–03 thru –09
(0.76)
.030
(0.89)
.035
DIA
–D–DP
= Differential Pair
(–01 only)
= Electro-Polished
Selective
50µ" (1.27 µm) min Au
over 150µ" (3.81 µm)
Ni on Signal Pins in
contact area,
10µ" (0.25 µm) min Au
over 50µ" (1.27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50µ"
(1.27 µm) min Ni
on all solder tails
QTH
LEAD
STYLE
–01
–02
–03
–04
–05
–07
–09
(0.64)
.025
= (7.00 mm)
.275" DIA
Polyimide
film Pick &
Place Pad
(N/A with -05 &
-07 lead style)
–TR
HEIGHT
= Tape & Reel
WITH
(–090 positions
QSH*
maximum)
(4.27) (5.00)
A
.168
(7.26)
.286
(10.27)
.404
(15.25)
.600
(18.26)
.718
(24.24)
.954
(13.26)
.522
.197
(8.00)
.315
(11.00)
.433
(16.00)
.630
(19.00)
.748
(25.00)
.984
(14.00)
.551
–L
= Latching
Option
(–01 lead
style only)
(N/A on
–060 (–D–DP)
& –090)
*Processing conditions
will affect mated height.
*Note: –C Plating passes
10 year MFG testing
–L
OTHER
OPTION
–K
–F
–L
ALSO AVAILABLE
A
TYPE
FILE NO: 090871_0_000
• 15 mm, 22 mm and
30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0.76 µm) Gold
(Specify -H plating
for Data Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 80 (-DP), 120, 150
positions per row
• Retention Option
Contact Samtec.
s
ocol
Prot orted
Supp
Note: Some lengths, styles
and options are non-standard,
non-returnable.
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
OTHER
SOLUTIONS
• Board Spacing Standoffs.
See SO Series.
