TACT SwitchTM
4.2×3.2mm Compact High Operating Force (Surface Mount Type)
SKRP Series
High operation force satisfy the needs in automotive applications. Wide stem & good mountability.
Detector
Push
Slide
Rotary
Encoders
Product Line
Operating Operating Travel Rating Rating Operating life Initial contact
Stem color
direction (mm)(max.)(min.)(5mA 5V DC) resistance
force
Power
Product No.
Dual-in-line
Package Type
SKRPABE010
1.57N
TACT SwitchTM
SKRPACE010
2.55N
CustomProducts
SKRPADE010
4N
Minimum order unit
(pcs.)
100,000cycles
Vertical
50mA
16V DC
0.2
10BA
1V DC
50,000cycles
Natural
500mΩ
max.
4,000
100,000cycles
Black
Specification of Embossed Taping Package (Taping Packaging for Auto-insertion)
Unit:mm
Reel Size
Number of packages pcs.)
(
Plastic Reel
1 reel
Soft
Feeling
40,000
Tape width
(mm)
40,000
12
13.5
Dimensions
Unit:mm
PC board land dimensions
(Viewed from switch mounting face)
Style
Radial
Type
4.6
4.2
3
2
2.7
2.2
1.6
3.2
1
Stem
3.1
4
5.2
2.5
1.8
1.6
3
R1.1
2.8
Surface
Mount Type
1.5
Snap-in
Type
¿380
1 case
/export packing
4,000
Sharp
Feeling
1 case
/Japan
Circuit Diagram
Note
1. Please place purchase orders for taping products per
minimum order unit (1 reel or a case).
2. For φ330mm diameter reel requirements, please contact us.
1
2
3
4
Refer to P.306 for soldering conditions.
282
TACT SwitchTM
Soldering Conditions
Condition for Reflow
Available for Surface Mount Type.
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA
(K) CC
or (T) solder joints copper foil surface) A heat resistive tape
at
(
.
Detector
Push
should be used to fix thermocouple.
3. Temperature profile
Temperature (˚C )
Slide
260˚C max. 3 sec max.
Rotary
230˚C
180
Encoders
150
Power
Time
Dual-in-line
Package Type
120 sec max. pre-heating )
(
40s max.
TACT SwitchTM
3 to 4min.
CustomProducts
Time inside soldering equipment
Note
1. The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC
board's temperature greatly differs from that of the switch, depending on the material, size, thickness of PC boards
and others. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
Sharp
Feeling
Soft
Feeling
Conditions for Auto-dip
(Except SKHJ, SKHL, SKQJ, SKQK, SKEG series)
Snap-in
Type
Surface
Mount Type
Manual Soldering(Except SKRT Series)
Available for Snap-in Type and Radial Type
Items
Condition
Items
Condition
Soldering temperature
350℃max.
Duration of soldering
Flux built-up
Radial
Type
Preheating temperature
Preheating time
Soldering temperature
Mounting surface
should not be exposed to fluk
Capacity of soldering iron
Ambient temperature of the soldered
surface of PC board.
100℃ max.
60s max.
260℃ max.
Duration of immersion
5s max.
Number of soldering
2times max.
Notes
1.
2.
3.
4.
5.
306
Consult with us for availability of TACT SwitchTM washing.
Prevent flux penetration from the top side of the TACT SwitchTM.
Switch terminals and a PC board should not be coated with flux prior to soldering.
The second soldering should be done after the switch is stable with normal temperature.
Use the flux with a specific gravity of min 0.81.
(EC-19S-8 by TAMURA Corporation, or equivalents.)
3s max.
60W max.