v1.0
ProASIC3L Low-Power Flash FPGAs
®
with Flash*Freeze Technology
Features and Benefits
Low Power
• Dramatic Reduction in Dynamic and Static Power Savings
• 1.2 V / 1.5 V Core and I/O Voltage Support for Low Power
• Low Power Consumption in Flash*Freeze™ Mode Allows for
Instantaneous Entry to / Exit from Low-Power Flash*Freeze
Mode
• Supports Single-Voltage System Operation
• Low-Impedance Switches
High Capacity
• 250 k to 3 M System Gates
• Up to 504 kbits of True Dual-Port SRAM
• Up to 620 User I/Os
Reprogrammable Flash Technology
•
•
•
•
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process
Live-at-Power-Up (LAPU) Level 0 Support
Single-Chip Solution
Retains Programmed Design when Powered Off
High Performance
• 350 MHz (1.5 V systems) and 250 MHz (1.2 V systems) System
Performance
• 3.3 V, 66 MHz, 66-Bit PCI (1.5 V systems) and 66 MHz, 32-Bit
PCI (1.2 V systems)
In-System Programming (ISP) and Security
• Secure ISP Using On-Chip 128-Bit Advanced Encryption
Standard (AES) Decryption via JTAG (IEEE 1532–compliant)
• FlashLock® to Secure FPGA Contents
High-Performance Routing Hierarchy
• Segmented, Hierarchical Routing and Clock Structure
• High-Performance, Low-Skew Global Network
• Architecture Supports Ultra-High Utilization
Advanced and Pro (Professional) I/Os
• 700 Mbps DDR, LVDS-Capable I/Os
• 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Table 1-1 • ProASIC3 Low-Power Product Family
• Bank-Selectable I/O Voltages—up to 8 Banks per Chip
• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X, and
LVCMOS 2.5 V / 5.0 V Input
• Differential I/O Standards: LVPECL, LVDS, BLVDS, and M-LVDS
• Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL
2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3
Class I and II (A3PE3000L only)
• I/O Registers on Input, Output, and Enable Paths
• Hot-Swappable and Cold-Sparing I/Os Programmable
Output Slew Rate and Drive Strength
• Programmable Input Delay (A3PE3000 only)
• Schmitt Trigger Option on Single-Ended Inputs (A3PE3000L)
• Weak Pull-Up/-Down
• IEEE 1149.1 (JTAG) Boundary Scan Test
• Pin-Compatible Packages across the ProASIC®3L Family
(except PQ208)
Clock Conditioning Circuit (CCC) and PLL
• Six CCC Blocks, One with Integrated PLL (ProASIC3L) and All
with Integrated PLL (ProASIC3EL)
• Configurable
Phase
Shift, Multiply/Divide,
Delay
Capabilities, and External Feedback
• Wide Input Frequency Range 1.5 MHz to 250 MHz (1.2 V
systems) and 350 MHz (1.5 V systems))
SRAMs and FIFOs
• Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,
and ×18 organizations available)
• True Dual-Port SRAM (except ×18)
• 24 SRAM and FIFO Configurations with Synchronous
Operation:
– 250 MHz: For 1.2 V systems
– 350 MHz: For 1.5 V systems
®
ARM Processor Support in ProASIC3L FPGAs
• ARM Cortex™-M1 Soft Processor Available with or without
Debug
ProASIC3L Devices
A3P250L
A3P600L
ARM Cortex-M1 Devices1
M1A3P600L
System Gates
250 k
600 k
VersaTiles (D-flip-flops)
6,144
13,824
RAM kbits (1,024 bits)
36
108
4,608-Bit Blocks
8
24
FlashROM Bits
1k
1k
Secure (AES) ISP2
Yes
Yes
Integrated PLL in CCCs3
1
1
VersaNet Globals
18
18
I/O Banks
4
4
Maximum User I/Os
157
235
Package Pins
VQFP
VQ100
PQFP
PQ208
PQ208
FBGA
FG144, FG256
FG144, FG256, FG484
Notes:
1. Refer to the Cortex-M1 product brief for more information.
2. AES is not available for ARM-enabled ProASIC3L devices.
3. For the A3PE3000L, the PQ208 package has six CCCs and two PLLs.
April 2008
© 2008 Actel Corporation
A3P1000L
M1A3P1000L
1M
24,576
144
32
1k
Yes
1
18
4
300
A3PE3000L
M1A3PE3000L
3M
75,264
504
112
1k
Yes
6
18
8
620
PQ208
FG144, FG256, FG484
PQ208 3
FG324, FG484, FG896
I