MITSUBISHI
PM50B4LA060
FLAT-BASE TYPE
INSULATED PACKAGE
PM50B4LA060
FEATURE
a) Adopting new 5th generation IGBT (CSTBT TM ) chip, which
performance is improved by 1µm fine rule process.
For example, typical Vce(sat)=1.55V @Tj=125°C
b) Over-temperature protection by detecting Tj of the CSTBT TM
chips and error output is possible from all each conservation upper and lower arm of IPM.
c) New small package
Reduce the package size by 10%, thickness by 22% from
S-DASH series.
• 2φ 50A, 600V Current-sense IGBT type inverter
• Monolithic gate drive & protection logic
• Detection, protection & status indication circuits for, shortcircuit, over-temperature & under-voltage (P-Fo available
from upper arm devices)
• UL Recognized Yellow Card No.E80276(N)
File No.E80271
APPLICATION
Photo voltaic power conditioner
PACKAGE OUTLINES
Dimensions in mm
L A B E L
11
120
106
7
3.25
16
16
3-2
3-2
16
15.25
2-φ5.5
MOUNTING HOLES
6-2
3
2-φ2.5
55
N
17.5
12
16
3-2
19.75
(19.75)
5
9
13
19
14.5
32
P
17.5
1
U
V
W
6-M5 NUTS
22 + 1
– 0.5
12
32.75
23
23
23
Terminal code
13
7
19-■0.5
31
12
(SCREWING DEPTH)
10.75
11.75
13.5
B
1.
2.
3.
4.
5.
6.
7.
VUPC
UFO
UP
VUP1
VVPC
VFO
VP
8.
9.
10.
11.
12.
13.
14.
VVP1
NC
NC
NC
NC
VNC
VN1
15.
16.
17.
18.
19.
NC
UN
VN
NC
Fo
Jun. 2007
