F-218 (Rev 10OCT17)
QSH–060–01–L–D–DP–A
QSH–060–01–L–D–A–K
®
QSH–030–01–F–D–A
(0.50 mm) .0197"
QSH SERIES
HIGH-SPEED GROUND PLANE SOCKET
Board Mates:
QTH
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSH
Blade &
Beam
Design
Cable Mates:
HQCD, HQDP
(See Also Available Note)
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating: Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(2 pins powered)
Ground Plane:
25 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
175 VAC (5 mm Stack Height)
Max Cycles: 100
RoHS Compliant: Yes
Integral metal plane
for power or ground
Standoffs:
SO
POWER/SIGNAL
APPLICATION
10 YEAR MFG
WITH 50 µ" GOLD
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
HIGH-SPEED CHANNEL PERFORMANCE
QTH/QSH @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
PROCESSING
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-060)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
25
G b p s
PINS PER ROW
NO. OF PAIRS
QSH
Compatible with
UMPT/UMPS for
flexible two-piece
power/signal solutions
PLATING
OPTION
01
–F
RECOGNITIONS
(60 total pins per bank = –D)
–020, –040, –060
PROTOCOLS
02
ALSO AVAILABLE
–DP = (No. of Pairs per Row/20) x
(20.00) .7875 + (1.27) .050
(20.00) .7875
(7.49)
.295
01
(MOQ Required)
Note: Some lengths, styles
and options are non-standard,
non-returnable.
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–D = (No. of Pins per Row/30) x
(20.00) .7875 + (1.27) .050
• 100 GbE
• Hypertransport™
• XAUI
• PCI Express®
• InfiniBand™
Contact Samtec.
–L
(20 pairs per bank = –D–DP)
FILE NO. E111594
• 15 mm, 22 mm and
30 mm stack height
• 30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 80 (-DP), 120, 150
positions per row
• Retention Option
= Gold Flash
on Signal Pins
and Ground Plane,
Matte Tin on tails
–030, –060, –090
For complete scope of
recognitions see
www.samtec.com/quality
(0.50)
.0197
(0.15)
.006
(3.05)
.120
(7.24)
.285 (0.76)
.030
(0.89)
.035
DIA
–L
A
TYPE
–D
= SingleEnded
–D–DP
= Differential
Pair
(–01 only)
–C*
= Electro-Polished
Selective
50 µ" (1.27 µm) min
Au over 150 µ" (3.81 µm)
Ni on Signal Pins
in contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over
50 µ" (1.27 µm) min Ni
on all solder tails
(3.25)
.128
*Note: –C Plating passes
10 year MFG testing
(0.64)
.025
–K
= (8.25 mm)
.325" DIA
Polyimide Film
Pick & Place Pad
–TR
= Tape & Reel
(–090 positions
maximum)
–L
= Latching
Option
(Not available on
–060 (–D–DP)
& –090 positions)
QTH
MATED HEIGHT
LEAD STYLE
WITH QSH*
–01
–02
–03
–04
–05
–07
–09
(5.00) .197
(8.00) .315
(11.00) .433
(16.00) .630
(19.00) .748
(25.00) .984
(14.00) .551
*Processing conditions will affect
mated height. See SO Series for
board space tolerances
Due to technical progress, all designs, specifications and components are subject to change without notice.
WWW.SAMTEC.COM
OTHER
OPTION
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
