NAND128-A, NAND256-A
NAND512-A, NAND01G-A
128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16)
528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories
FEATURES SUMMARY
■
HIGH DENSITY NAND FLASH MEMORIES
–
Up to 32 Mbit spare area
–
■
Up to 1 Gbit memory array
–
Cost effective solutions for mass storage
applications
NAND INTERFACE
–
Multiplexed Address/ Data
–
Pinout compatibility for all densities
SUPPLY VOLTAGE
–
1.8V device: VDD = 1.7 to 1.95V
–
■
3.0V device: VDD = 2.7 to 3.6V
x8 device: (512 + 16 spare) Bytes
–
x16 device: (256 + 8 spare) Words
x8 device: (16K + 512 spare) Bytes
–
x16 device: (8K + 256 spare) Words
PAGE READ / PROGRAM
–
Page program time: 200µs (typ)
■
–
STATUS REGISTER
■
ELECTRONIC SIGNATURE
■
DATA INTEGRITY
■
100,000 Program/Erase cycles
–
10 years Data Retention
RoHS COMPLIANCE
–
Block erase time: 2ms (Typ)
■
Program/Erase locked during Power
transitions
–
Fast page copy without external buffering
FAST BLOCK ERASE
HARDWARE DATA PROTECTION
–
COPY BACK PROGRAM MODE
–
■
■
Sequential access: 50ns (min)
–
VFBGA55 8 x 10 x 1mm
VFBGA63 9 x 11 x 1mm
Random access: 12µs (3V)/15us (1.8V)
(max)
–
■
FBGA
BLOCK SIZE
–
■
USOP48 12 x 17 x 0.65mm
PAGE SIZE
–
■
TSOP48 12 x 20mm
x8 or x16 bus width
–
■
Figure 1. Packages
CHIP ENABLE ‘DON’T CARE’
■
Lead-Free Components are Compliant
with the RoHS Directive
DEVELOPMENT TOOLS
–
Bad Blocks Management and Wear
Leveling algorithms
File System OS Native reference software
–
■
Simple interface with microcontroller
Error Correction Code software and
hardware models
–
–
–
Hardware simulation models
SERIAL NUMBER OPTION
August 2005
1/56