NTD20P06L, NTDV20P06L
Power MOSFET
−60 V, −15.5 A, Single P−Channel, DPAK
Features
•
•
•
•
Withstands High Energy in Avalanche and Commutation Modes
Low Gate Charge for Fast Switching
AEC Q101 Qualified − NTDV20P06L
These Devices are Pb−Free and are RoHS Compliant
www.onsemi.com
V(BR)DSS
• Bridge Circuits
• Power Supplies, Power Motor Controls
• DC−DC Conversion
ID MAX
(Note 1)
−60 V
Applications
RDS(on) TYP
130 mW @ −5.0 V
−15.5 A
P−Channel
D
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Symbol
Gate−to−Source
Voltage
Continuous
Unit
VDSS
Drain−to−Source Voltage
Value
−60
V
VGS
$20
V
Non−Repetitive
tp v10 ms
VGSM
Steady State
TA = 25°C
ID
−15.5
Power Dissipation (Note 1)
Steady State
S
$30
Continuous
Drain Current
(Note 1)
G
MARKING DIAGRAMS
A
4
PD
65
IDM
$50
A
Operating Junction and Storage Temperature
TJ,
TSTG
−55 to
175
°C
Single Pulse Drain−to−Source Avalanche
Energy (VDD = 25 V, VGS = 5 V, IPK = 15 A,
L = 2.7 mH, RG = 25 W)
EAS
304
mJ
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
TL
tp = 10 ms
Pulsed Drain
Current
W
1 2
3
4
°C
260
THERMAL RESISTANCE RATINGS
Parameter
DPAK
CASE 369C
STYLE 2
1
Symbol
Max
Unit
Junction−to−Case (Drain)
RqJC
2.3
°C/W
Junction−to−Ambient – Steady State (Note 1)
RqJA
80
Junction−to−Ambient – Steady State (Note 2)
RqJA
2
1
3
Drain
Gate
Source
4
Drain
AYWW
T20
P06LG
TA = 25°C
4
Drain
AYWW
T20
P06LG
Parameter
2
3
IPAK/DPAK
CASE 369D
STYLE 2
110
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface−mounted on FR4 board using 1 in sq. pad size
(Cu area = 1.127 in sq. [1 oz] including traces)
2. Surface−mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.412 in sq.)
20P06L
A
Y
WW
G
1 2 3
Gate Drain Source
Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
October, 2016 − Rev. 7
1
Publication Order Number:
NTD20P06L/D
