MC33269, NCV33269
800 mA, Adjustable Output,
Low Dropout Voltage
Regulator
The MC33269/NCV33269 series are low dropout, medium current,
fixed and adjustable, positive voltage regulators specifically designed
for use in low input voltage applications. These devices offer the
circuit designer an economical solution for precision voltage
regulation, while keeping power losses to a minimum.
The regulator consists of a 1.0 V dropout composite PNP−NPN pass
transistor, current limiting, and thermal shutdown.
http://onsemi.com
1
GND/Adj
• 3.3 V, 3.5 V, 5.0 V, 12 V and Adjustable Versions
•
Vout
2.85 V version available as MC34268
Space Saving DPAK, SO−8 and SOT−223 Power Packages
1.0 V Dropout
Output Current in Excess of 800 mA
Thermal Protection
Short Circuit Protection
Output Trimmed to 1.0% Tolerance
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These are Pb−Free Devices
Vin
1
8
2
Features
•
•
•
•
•
•
•
SO−8
D SUFFIX
CASE 751
8
7
3
6
4
5
NC
Vout
NC
(Top View)
DPAK
DT SUFFIX
CASE 369C
1
3
1. GND/Adj
2. Vout
3. Vin
1
3
SOT−223
ST SUFFIX
CASE 318E
1 2 3
(Top View)
1
2
3
(Top View)
DEVICE TYPE/NOMINAL OUTPUT VOLTAGE
MC33269D
NCV33269D*
MC33269DT
NCV33269DTRK*
MC33269T
MC33269D−3.3
MC33269DT−3.3
NCV33269DTRK−3.3*
MC33269T−3.3
MC33269ST−3.3
Adj
Adj
Adj
Adj
Adj
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
MC33269T−3.5
MC33269D−5.0
MC33269DT−5.0
NCV33269DT−5.0*
NCV33269DTRK−5.0*
MC33269T−5.0
MC33269D−012
MC33269DT−012
NCV33269DTRK−012*
MC33269T−012
3.5 V
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
12 V
12 V
12 V
12 V
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and
Control Change Requirements; AEC−Q100 Qualified and PPAP Capable.
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
TO−220AB
T SUFFIX
CASE 221AB
1
2
3
1. GND/Adj
2. Vout
3. Vin
12 3
(Top View)
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 8 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 28
1
Publication Order Number:
MC33269/D
