SML-M1 Series / MN Series
Features
Datasheet
Outline
• Compact LED with reflector
• Die is located at the center of the package,achieving
equivalent distribution of light emission.
Size
Color
Type
V
U
D
Y
M
20125 (0805)
2.0×1.25mm (t=0.8mm)
P
B
WB
Dimensions
Recommended Solder Pattern
0.8±0.1
2.0
0.3
1.1
Through Hole
Cathode Index
PCB Bonding Direction
0.85
1.25
1.4
1.25
1.1
1.25
0.9
2-R0.3
Electrode
1.0
Tolerance : 0.2
(unit : mm)
(unit : mm)
Specifications
Part No.
Chip
Structure
Emitting
Color
Absolute Maximum Ratings (Ta=25ºC)
Peak Forward Reverse
Operating Temp. Storage Temp.
Dissipation Current
Current Voltage
PD(mW) IF(mA) IFP(mA) VR(V)
Topr(ºC)
Tstg(ºC)
Power Forward
Electrical and Optical Characteristics (Ta=25ºC)
Forward Voltag VF Reverse Current IR
Typ.
(V)
IF
Max.
VR
(mA)
(A)
(V)
SML-M13VT
Dominant Wavelength D Luminous Intensity IV
IF
Min. Typ.
Min.*2 Typ. Max.*2 IF
(nm) (nm) (nm) (mA) (mcd) (mcd) (mA)
625
630
635
40
75
615
620
625
63
120
602
605
608
Red
SML-M13UT
2.0
75
SML-M13DT
Orange
AIGaInP
30
SML-M13YT
Yellowish
Green
5
40 to 85
20
10
5
Yellow
SML-M13MT
100*1
SMLMN2WB1CW
572
575
25
45
557
560
563
6.3
16
68
593
160
470
-
14
36
56
140
2.2
Blue
InGaN
590
569
81
Green
SMLMN2BCT
20
100
587
40 to 100
SML-M13PT
200
20
20
100
12
40 to 100
2.9
5
10
(x,y)(0.30, 0.28)
White
5
5
12
1 : Duty 1/10, 1kHz 2 : Reference
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2016.03 - Rev.H