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MMSZ5268BT1G

製品説明
仕様・特性

MMSZ52xxxT1G Series, SZMMSZ52xxxT1G Series Zener Voltage Regulators 500 mW SOD−123 Surface Mount Three complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style. Zener voltage in this series are specified with device junction in thermal equilibrium. www.onsemi.com Features • 500 mW Rating on FR−4 or FR−5 Board • Wide Zener Reverse Voltage Range − 2.4 V to 110 V @ Thermal • • • • • • SOD−123 CASE 425 STYLE 1 Equilibrium* Package Designed for Optimal Automated Board Assembly Small Package Size for High Density Applications General Purpose, Medium Current ESD Rating of Class 3 (> 16 kV) per Human Body Model SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These are Pb−Free Devices* Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL 94 V−0 Total Power Dissipation on FR−5 Board, (Note 1) @ TL = 75°C Derated above 75°C 2 Anode MARKING DIAGRAM 1 xx M G xx MG G = Device Code (Refer to page 3) = Date Code = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device MAXIMUM RATINGS Rating 1 Cathode Package Shipping† Max Units MMSZ52xxBT1G, SZMMSZ52xxBT1G SOD−123 (Pb−Free) 3,000 / Tape & Reel 500 6.7 Symbol mW mW/°C MMSZ52xxCT1G, SZMMSZ52xxCT1G SOD−123 (Pb−Free) 3,000 / Tape & Reel PD Thermal Resistance, Junction−to−Ambient (Note 2) RqJA 340 °C/W MMSZ52xxBT3G, SZMMSZ52xxBT3G SOD−123 (Pb−Free) 10,000 / Tape & Reel Thermal Resistance, Junction−to−Lead (Note 2) RqJL 150 °C/W MMSZ52xxCT3G, SZMMSZ52xxCT3G SOD−123 (Pb−Free) 10,000 / Tape & Reel TJ, Tstg −55 to +150 °C Junction and Storage Temperature Range Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint. 2. Thermal Resistance measurement obtained via infrared Scan Method. *For additional info on thermal equilibrium, please download, ON Semiconductor TVS/Zener Theory and Design Considerations Handbook, HBD854/D. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2015 March, 2015 − Rev. 14 1 Publication Order Number: MMSZ5221BT1/D

ブランド

ONS

会社名

ON Semiconductor

本社国名

U.S.A

事業概要

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