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OMAP3530DCBB

製品説明
仕様・特性

OMAP3530, OMAP3525 www.ti.com SPRS507H – FEBRUARY 2008 – REVISED OCTOBER 2013 OMAP3530 and OMAP3525 Applications Processors Check for Samples: OMAP3530, OMAP3525 1 OMAP3530 and OMAP3525 Applications Processors 1.1 Features 12 • OMAP3530 and OMAP3525 Devices: – OMAP™ 3 Architecture – MPU Subsystem • Up to 720-MHz ARM® Cortex™-A8 Core • NEON™ SIMD Coprocessor – High-Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem • Up to 520-MHz TMS320C64x+™ DSP Core • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels) • Video Hardware Accelerators – PowerVR® SGX™ Graphics Accelerator (OMAP3530 Device Only) • Tile-Based Architecture Delivering up to 10 MPoly/sec • Universal Scalable Shader Engine: Multithreaded Engine Incorporating Pixel and Vertex Shader Functionality • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0 • Fine-Grained Task Switching, Load Balancing, and Power Management • Programmable High-Quality Image AntiAliasing – Fully Software-Compatible with C64x and ARM9™ – Commercial and Extended Temperature Grades • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+ DSP Core – Eight Highly Independent Functional Units • Six ALUs (32- and 40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle • Two Multipliers Support Four 16 x 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 x 8-Bit Multiplies (16-Bit Results) per Clock Cycle – Load-Store Architecture with Nonaligned Support – 64 32-Bit General-Purpose Registers – Instruction Packing Reduces Code Size – All Instructions Conditional – Additional C64x+ Enhancements • • • • • • Protected Mode Operation Exceptions Support for Error Detection and Program Redirection • Hardware Support for Modulo Loop Operation C64x+ L1 and L2 Memory Architecture – 32KB of L1P Program RAM and Cache (Direct Mapped) – 80KB of L1D Data RAM and Cache (2-Way Set-Associative) – 64KB of L2 Unified Mapped RAM and Cache (4-Way Set-Associative) – 32KB of L2 Shared SRAM and 16KB of L2 ROM C64x+ Instruction Set Features – Byte-Addressable (8-, 16-, 32-, and 64-Bit Data) – 8-Bit Overflow Protection – Bit Field Extract, Set, Clear – Normalization, Saturation, Bit-Counting – Compact 16-Bit Instructions – Additional Instructions to Support Complex Multiplies ARM Cortex-A8 Core – ARMv7 Architecture • TrustZone® • Thumb®-2 • MMU Enhancements – In-Order, Dual-Issue, Superscalar Microprocessor Core – NEON Multimedia Architecture – Over 2x Performance of ARMv6 SIMD – Supports Both Integer and Floating-Point SIMD – Jazelle® RCT Execution Environment Architecture – Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack – Embedded Trace Macrocell (ETM) Support for Noninvasive Debug ARM Cortex-A8 Memory Architecture: – 16-KB Instruction Cache (4-Way Set- 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2013, Texas Instruments Incorporated

ブランド

TI

会社名

Texas Instruments Incorporated

本社国名

U.S.A

事業概要

世界25ヶ国以上に製造・販売拠点を有する国際的な半導体企業であり、デジタル情報家電、ワイヤレス、ブロードバンド市場に欠かせないデジタル信号処理を行うDSPと、それに関連するアナログIC、マイクロコントローラを主力製品としている。

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