Micron Confidential and Proprietary
32Gb, 64Gb, 128Gb: NAND Flash
Features
NAND Flash Memory
MT29F32G08CBAAA, MT29F64G08CFAAA, MT29F64G08CEAAA,
MT29F128G08CJAAA, MT29F128G08CKAAA, MT29F128G08CMAAA
Features
Figure 1:
• Open NAND Flash Interface (ONFI) 2.0-compliant
• Multilevel cell (MLC) technology
• Organization
Page size: x8: 4314 bytes (4096 + 218 bytes)
– Block size: 128 pages (512K + 27K bytes)
– Plane size: 4096 blocks
– Device size: 32Gb, 8192 blocks; 64Gb, 16,384
blocks; 128Gb, 32,768 blocks
• READ performance
– Random read: 50µs
– Sequential read: 20ns
• PROGRAM performance
– Page program: 900µs (TYP)
– Block erase: 4ms (TYP)
• Endurance: 5000 PROGRAM/ERASE cycles1
• Data retention: 10 years
• First block (block address 00h) guaranteed to be
valid with ECC when shipped from factory1
• Industry-standard basic NAND Flash command set
• Advanced command set
– PROGRAM PAGE CACHE MODE
– PAGE READ CACHE MODE
– Two-plane commands
– Interleaved die operations
– READ UNIQUE ID
• Operation status byte provides a software method of
detecting:
– Operation completion
– Pass/fail condition
– Write protect status
• Ready/busy# (R/B#) signal provides a hardware
method of detecting PROGRAM and ERASE cycle
completion
• WP# signal: entire-device hardware write protect
• RESET required as first command after power-up
• INTERNAL DATA MOVE operations supported
within the plane from which data is read
PDF: 09005aef8331b189 / Source: 09005aef8331b1c4
32gb_nand_mlc_l63a__1.fm - Rev. F 10/09 EN
48-Pin TSOP Type 1
Options
• Density2: 32Gb, 64Gb, 128Gb
• Device width: x8
• Configuration:
# of die # of CE# # of R/B#
I/O
1
1
1
TSOP
Common
2
2
2
TSOP
Common
4
2
2
TSOP
Common
2
2
2
LGA
Separate
4
2
2
LGA
Separate
4
4
4
LGA
Separate
• VCC: 2.7–3.6V
• Package: 48-pin TSOP type I (lead-free plating),
52-pad LGA
• Operating temperature:
– Commercial temperature (0°C to +70°C)
– Industrial temperature (–40°C to +85°C)
Notes: 1. For details, see “Error Management” on
page 88.
2. For part numbering and markings, see “Part
Numbering Information” on page 2.
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
