Zener diode
UDZS8.2B
Dimensions (Unit : mm)
1.25±0.1
Land size figure (Unit : mm)
0.1±0.1
0.05
0.8MIN.
0.9MIN.
2.5±0.2
1.7±0.1
Features
1) Compact, 2-pin mini-mold type for
high-density mounting. (UMD2)
2) High reliability.
3) Can be mounted automatically,
using chip mounter.
2.1
Applications
Constant voltage control
UMD2
Construction
Silicon epitaxial planar
Structure
0.7±0.2
0.1
0.3±0.05
ROHM : UMD2
JEDEC : S0D-323
JEITA : SC-90/A
dot (year week factory)
EX. UDZS3.6B
Taping specifications (Unit : mm)
0.3±0.1
φ1.55±0.05
8.0±0.2
2.75
4.0±0.1
1.40±0.1
2.8±0.1
2.0±0.05
3.5±0.05 1.75±0.1
4.0±0.1
φ1.05
1.0±0.1
Absolute maximum ratings (Ta=25C)
Parameter
Power dissipation
Junction temperature
Storage temperature
Operating temperature
Symbol
P
Tj
Tstg
Topr
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○ 2012 ROHM Co., Ltd. All rights reserved.
Limits
200
150
-55 to +150
-55 to +150
1/4
Unit
mW
℃
℃
℃
2012.02 - Rev.D
UDZS8.2B
Data Sheet
Electrical characteristic curves (Ta=25C)
10
ZENER CURRENT:Iz(mA)
1
0.1
5.1
4.7
0.01
5.6
6.8
4.3
6.2
3.9
7.5
8.2 9.1
10
3.6
11 12 13 15
16
18
22
20
24
27
30
33
36
0.001
0
5
10
15
20
25
30
35
40
ZENER VOLTAGE:Vz(V)
Vz-Iz CHARACTERISTICS
10000
REVERSE SURGE MAXIMUM
POWER:PRSM(W)
POWER DISSIPATION:Pd(mW)
250
150
100
50
0
25
50
75
100
125
150
t
100
10
1
0.1
0.001
0
AMBIENT TEMPERATURE:Ta(℃)
Pd-Ta CHARACTERISTICS
0.01
0.1
1
10
100
TIME:t(ms)
PRSM-TIME CHARACTERISTICS
0.12
40
0.1
35
0.08
30
1000
0.06
25
0.04
20
0.02
15
0
10
-0.02
-0.04
5
-0.06
0
-0.08
-5
0
10
20
30
ZENER VOLTAGE:Vz(V)
γz-Vz CHARACTERISTICS
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c
○ 2012 ROHM Co., Ltd. All rights reserved.
40
TRANSIENT
THAERMAL IMPEDANCE:Rth (℃/W)
Rth(j-a)
TEMP.COEFFICIENCE:γz(mV/℃)
TEMP.COEFFICIENCE:γz(%/℃)
PRSM
1000
200
100
Rth(j-c)
10
Mounted on epoxy board
IM=10mA
IF=100mA
1
1ms
time
300us
0.1
0.001
3/4
0.01
0.1
1
10
100
TIME:t(s)
Rth-t CHARACTERISTICS
1000
2012.02 - Rev.D