SN74LVC1G97
CONFIGURABLE MULTIPLE-FUNCTION GATE
www.ti.com
SCES416I – DECEMBER 2002 – REVISED MARCH 2006
FEATURES
•
•
•
•
•
•
•
•
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
Supports 5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 6.3 ns at 3.3 V
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
Choose From Nine Specific Logic Functions
•
•
DCK PACKAGE
(TOP VIEW)
DBV PACKAGE
(TOP VIEW)
1
6
In1
1
6
In2
GND
In1
2
5
VCC
In0
3
4
2
5
VCC
In0
3
4
In1
1
6
In2
GND
2
5
VCC
In0
3 4
Y
GND
2 5
VCC
In1
1 6
In2
Y
In2
GND
YEA, YEP, YZA,
OR YZP PACKAGE
(BOTTOM VIEW)
DRL PACKAGE
(TOP VIEW)
In0
3
4
Y
Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This configurable multiple-function gate is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G97 features configurable multiple functions. The output state is determined by eight patterns of
3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All
inputs can be connected to VCC or GND.
ORDERING INFORMATION
PACKAGE (1)
TA
ORDERABLE PART NUMBER
NanoStar™ – WCSP (DSBGA)
0.17-mm Small Bump – YEA
NanoFree™ – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
–40°C to 85°C
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
TOP-SIDE MARKING (2)
SN74LVC1G97YEAR
SN74LVC1G97YZAR
Tape and reel
_ _ _CS_
SN74LVC1G97YEPR
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SN74LVC1G97YZPR
SOT (SOT-23) – DBV
(2)
SN74LVC1G97DBVR
C97_
Tape and reel
SN74LVC1G97DCKR
CS_
SOT (SOT-563) – DRL
(1)
Tape and reel
SOT (SC-70) – DCK
Reel of 4000
SN74LVC1G97DRLR
CS_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, ⋅ = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2006, Texas Instruments Incorporated