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SN74LVC1G97DC

製品説明
仕様・特性

SN74LVC1G97 CONFIGURABLE MULTIPLE-FUNCTION GATE www.ti.com SCES416I – DECEMBER 2002 – REVISED MARCH 2006 FEATURES • • • • • • • • Available in the Texas Instruments NanoStar™ and NanoFree™ Packages Supports 5-V VCC Operation Inputs Accept Voltages to 5.5 V Max tpd of 6.3 ns at 3.3 V Low Power Consumption, 10-µA Max ICC ±24-mA Output Drive at 3.3 V Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) Choose From Nine Specific Logic Functions • • DCK PACKAGE (TOP VIEW) DBV PACKAGE (TOP VIEW) 1 6 In1 1 6 In2 GND In1 2 5 VCC In0 3 4 2 5 VCC In0 3 4 In1 1 6 In2 GND 2 5 VCC In0 3 4 Y GND 2 5 VCC In1 1 6 In2 Y In2 GND YEA, YEP, YZA, OR YZP PACKAGE (BOTTOM VIEW) DRL PACKAGE (TOP VIEW) In0 3 4 Y Y See mechanical drawings for dimensions. DESCRIPTION/ORDERING INFORMATION This configurable multiple-function gate is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC1G97 features configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All inputs can be connected to VCC or GND. ORDERING INFORMATION PACKAGE (1) TA ORDERABLE PART NUMBER NanoStar™ – WCSP (DSBGA) 0.17-mm Small Bump – YEA NanoFree™ – WCSP (DSBGA) 0.17-mm Small Bump – YZA (Pb-free) –40°C to 85°C NanoStar™ – WCSP (DSBGA) 0.23-mm Large Bump – YEP TOP-SIDE MARKING (2) SN74LVC1G97YEAR SN74LVC1G97YZAR Tape and reel _ _ _CS_ SN74LVC1G97YEPR NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP (Pb-free) SN74LVC1G97YZPR SOT (SOT-23) – DBV (2) SN74LVC1G97DBVR C97_ Tape and reel SN74LVC1G97DCKR CS_ SOT (SOT-563) – DRL (1) Tape and reel SOT (SC-70) – DCK Reel of 4000 SN74LVC1G97DRLR CS_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, ⋅ = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, NanoFree are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2002–2006, Texas Instruments Incorporated

ブランド

TI

会社名

Texas Instruments Incorporated

本社国名

U.S.A

事業概要

世界25ヶ国以上に製造・販売拠点を有する国際的な半導体企業であり、デジタル情報家電、ワイヤレス、ブロードバンド市場に欠かせないデジタル信号処理を行うDSPと、それに関連するアナログIC、マイクロコントローラを主力製品としている。

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