F-215 (Rev 13JUL15)
QSE–028–01–F–D–DP–A
®
QSE–060–01–F–D–A
QSE–020–01–L–D–A
(0.80 mm) .0315"
QSE SERIES
HIGH SPEED GROUND PLANE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSE
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1.27 µm) Ni
Current Rating:
Contacts:
2 A per pin
(1 pin powered per row)
Ground Plane:
23 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
225 VAC (5 mm Stack Height)
Max Cycles: 100
RoHS Compliant: Yes
Processing:
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-060)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
Integral metal plane
for power or ground
Blade &
Beam
Design
Board Mates:
QTE
100 GbE
XAUI ®
PCI Express
SATA
t I/O)
MGT (Rocke ™
finiBand
In
notes at
Download app ppnote
/a
w.samtec.com c.com
ww
te
t SIG @ sam
Contac
ols
ns on protoc
for questio
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
Single-Ended Signaling
–D
9 GHz / 18 Gbps
9 GHz / 18 Gbps
Differential Pair Signaling
–D
8 GHz / 16 Gbps
14 GHz / 28 Gbps
Differential Pair Signaling
–DP 8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QSE or contact sig@samtec.com
QTE/QSE
5 mm Stack Height
Type
PINS PER ROW
NO. OF PAIRS
QSE
01
RECOGNITIONS
PLATING
OPTION
A
TYPE
OTHER
OPTION
–F
For complete scope of
recognitions see
www.samtec.com/quality
= Gold Flash on
Signal Pins and
Ground Plane, Matte
Tin on tails
–020, –040, –060
(40 total pins per bank = –D)
–014, –028, –042
ALSO AVAILABLE
–D = (No. of Positions per Row/20) x
(20.00) .7875 + (1.27) .050
02
(20.00) .7875
(7.24)
.285
01
(3.05)
.120
(0.80)
.0315
(0.15)
.006
–C*
= Electro-Polished
Selective
50µ" (1.27 µm) min
Au over 150µ"
(7.49)
.295 (3.81 µm) Ni on Signal
Pins in contact area,
10µ" (0.25 µm) min
Au over 50µ" (1.27 µm)
Ni on Ground Plane
(3.25)
in contact area,
.128
Matte Tin over 50µ"
(1.27 µm) min Ni on
all solder tails
(0.89)
.035
DIA
–D–DP
(0.64)
.025
–K
= (8.25 mm) .325"
DIA Polyimide
Film Pick &
Place Pad
QTE
MATED
LEAD HEIGHT
STYLE WITH QSE*
–01
–02
–03
–04
–05
–07
–09
–TR
= Tape & Reel
Packaging
(5.00) .197
(8.00) .315
(11.00) .433
(16.00) .630
–L
= Latching Option
(N/A on –042
& –060 positions)
(19.00) .748
(25.00) .984
(14.00) .551
*Processing conditions
will affect mated
height.
*Note: –C Plating passes
10 year MFG testing
(0.76)
.030
–GP
= Guide Post
(–020 only)
= Differential
Pair
(–01 only)
= 10µ" (0.25 µm) Gold
on Signal Pins
and Ground Plane,
Matte Tin on tails
–D–DP = (No. of Positions per Row/14) x
(20.00) .7875 + (1.27) .050
(MOQ Required)
–D
= SingleEnded
–L
(14 pairs per bank = –D–DP)
FILE NO: 090871_0_000
• 15 mm, 22 mm and
30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount
• 56 (-DP), 80, 100
positions per row
• Guide Posts and Friction
Lock options.
• Retention Option
Contact Samtec.
s
ocol
Prot orted
Supp
Cable Mates:
EQCD, EQDP EQRF
,
(See Also Available note)
Note: Some lengths, styles
and options are non-standard,
non-returnable.
–L
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
OTHER
SOLUTIONS
• Board Spacing Standoffs.
See SO Series
