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74F20SCX
54F 74F20 Dual 4-Input NAND Gate General Description This device contains two independent gates each of which performs the logic NAND function Commercial Package Number Military N14A 14-Lead (0 300 Wide) Molded Dual-In-Line J14A 14-Lead Ceramic Dual-In-Line 74F20SC (Note 1) M14A 14-Lead (0 150 Wide) Molded Small Outline JEDEC 74F20SJ (Note 1) M14D 14-Lead (0 300 Wide) Molded Small Outline EIAJ 54F20FM (Note 2) W14B 14-Lead Cerpack 54F20LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier Type C et 54F20DM (Note 2) e 74F20PC Package Description Note 1 Devices also available in 13 reel Use suffix e SCX and SJX Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB Connection Diagrams bs ol Logic Symbol IEEE IEC Pin Assignment for DIP SOIC and Flatpak Pin Assignment for LCC O TL F 9462 – 2 TL F 9462 – 1 TL F 9462–3 Unit Loading Fan Out Pin Names An Bn Cn Dn On Description Inputs Outputs 54F 74F UL HIGH LOW Input IIH IIL Output IOH IOL 10 10 50 33 3 20 mA b0 6 mA b 1 mA 20 mA TRI-STATE is a registered trademark of National Semiconductor Corporation C1995 National Semiconductor Corporation TL F 9462 RRD-B30M75 Printed in U S A 54F 74F20 Dual 4-Input NAND Gate November 1994 AC Electrical Characteristics 74F Symbol Parameter 54F 74F TA e a 25 C VCC e a 5 0V CL e 50 pF TA VCC e Mil CL e 50 pF TA VCC e Com CL e 50 pF Min tPLH tPHL Propagation Delay An Bn Cn Dn to On Typ Max Min Max Min Max 24 15 37 32 50 43 20 15 70 65 24 15 60 53 Units ns Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F 20 S X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13 reels e Temperature Range Family 74F e Commercial 54F e Military C Device Type Temperature Range C e Commercial (0 C to a 70 C) M e Military (b55 C to a 125 C) et Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ O bs ol Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 3
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