THIN FILM SURFACE MOUNT RESISTORS
WATF SERIES
DAT
MECHANICAL DATA
W
T
L
Full Wrap Around
W
T
L
W
0.040" x 0.020" x 0.010"
0.035" x 0.035" x 0.010"
0.075" x 0.050" x 0.010"
0.050" x 0.050" x 0.010"
0.126" x 0.063" x 0.010"
0.100" x 0.050" x 0.010"
0.020" x 0.020" x 0.010"
0.055" x 0.025" x 0.010"
0.153" x 0.050" x 0.010"
99.6% ALUMINA, ALUMINUM NITRIDE
TANT
ANTALUM
NICHROME OR TANTALUM NITRIDE
SERIES
WATF - 1
WATF - 2
WATF - 3
WATF - 4
WATF - 5
WATF - 6
WATF - 7
WATF - 8
WATF - 9
SUBSTRATE
SUBSTRATE
RESISTOR
BOND PADS
AND WRAPAROUND
TERMINATIONS
TERMINATIONS
TOLERANCE
(±0.003")
(±0.003")
(±0.003")
(±0.003")
(±0.003")
(±0.003")
(±0.003")
(±0.003")
(±0.003")
STANDARD.
GOLD WITH NICKEL BARRIER STANDARD.
TERMINATION
OPTIONAL WITH SOLDER; OR HALF-WRAP TERMINATION
DAT
ELECTRICAL DATA
T
L
Half-Wrap
SERIES
WATF
WATF
WATF
WATF
WATF
WATF
WATF
WATF
WATF
ABSOLUTE
T.C.R.
RATING
POWER RATING
@ 70°C
OHMIC VALUE
125mW
18KΩ
2 Ω − 18KΩ
250mW
150KΩ
2 Ω − 150KΩ
250mW
400KΩ
2 Ω − 400KΩ
250mW
400KΩ
2 Ω − 400KΩ
500mW
2 Ω − 700KΩ
700KΩ
250mW
625KΩ
2 Ω − 625KΩ
125mW
51KΩ
2 Ω − 51KΩ
250mW
100KΩ
2 Ω − 100KΩ
500mW
1MΩ
2 Ω − 1MΩ
0.1%, 0.5%, 1%, 2%, 5%, 10%
STANDARD
±100ppm/° STANDARD (TaN)
±25ppm/°C STANDARD (NiCr); ±100ppm/°C STANDARD (TaN)
OPTIONAL TO ±25ppm/°C
-1
-2
-3
-4
-5
-6
-7
-8
-9
TOLERANCE
DAT
SERIES DATA
101Ω
250KΩ
101Ω TO 250KΩ: -40dB
100Ω
250KΩ
≤ 100Ω, ≥ 250KΩ: -30dB
400 V MIN.
1012Ω MIN.
100 V MAX.
RATED
25°
±0.
0.2
5X RATED POWER, 25° C, 5 SEC., ±0.25% MAX. ∆R/R: ±0.1% MSI TYPICAL
±0.25%
0.03
03%
150°C, 100 HRS., ±0.25% MAX. ∆R/R: ±0.03% MSI TYPICAL
107F, ±0.25%
MIL-STD 202, METHOD 107F, ±0.25% MAX. ∆R/R: ±0.1% MSI TYPICAL
±0.
0.5
0.1
MIL-STD 202, METHOD 106, ±0.5% MAX. ∆R/R: ±0.1% MSI TYPICAL
70°C,
POWER, ±0.5%
1000 HRS., 70°C, 100% POWER, ±0.5% MAX. ∆R/R: ±0.1% MSI TYPICAL
-55
-55°C TO +150°C
DC THROUGH 20 GHz
CURRENT NOISE
DIELECTRIC BREAKDOWN
INSULATION RESISTANCE
INSULATION RESISTANCE
OPERATING VOLT
OPERATING VOLTAGE
SHORT TERM OVERLOAD
HIGH TEMP EXPOSURE
THERMAL SHOCK
RESISTANCE
MOISTURE RESISTANCE
STABILITY
STABILITY
OPERATING
OPERATING TEMP RANGE
FREQUENCY
STRAY DISTRIBUTED
CAPACIT
ACITANCE
CAPACITANCE
(TaN)
0.06pF (NiCr); 0.08pF (TaN)
DESIGNATION
PART NUMBER DESIGNATION
WATF
THIN FILM DIVISION
DCN TF 111-E-0403
XXXXX
X
X
SUBSTRATE
SUBSTRATE
TOLERANCE
OPTION
A = Alumina
N = Aluminum
Nitride
RESISTIVE
FILM
N = Nichrome
T = Tantalum
Nitride
OHMIC VALUE
1, 2
3, 4
5, 6
7, 8
9
45 FRANK MOSSBERG DRIVE, ATTLEBORO, MA 02703
508-226-2111 FAX: 508-226-2211
X
SERIES
MINI-SYSTEMS, INC.
X
5-Digit Number:
1st 4 Digits Are
Significant With
"R" As Decimal
Point When
Required.
5th Digit
Represents
Number of Zeros.
B
D
F
G
J
K
= 0.1%*
= 0.5%*
= 1%
= 2%
= 5%
= 10%
Consult Sales for power capabilities
on Aluminum Nitride.
* Value Dependent
** For Conductive Epoxy Mount.
*** For Solder Mount.
**** Consult Sales for Availability.
EXAMPLE: WATF 1AN-50R00F-T = 0.040" x 0.020" x 0.010", Alumina Substrate,
Resistor, 50Ω
Tol.,
Solder.
Wrap
Nichrome Resistor, 50Ω, ±1% Tol., ±25ppm/°C, w/ Solder. Full Wrap Around.
A = ±50ppm/°C
B = ±25ppm/°C
HWU = Half-Wrap
Untinned
T = With SN62
Solder ***
TR = Tape and
Reel ****
U = Untinned**
HWT = Half-Wrap
Tinned.
(Solder option
applies to all
Conductor
Surfaces)
35
