1136 ITT - CCM Catalog 11/20/00 12:28 PM Page 29
CCM03 MK II
A new range of CCM03 connectors
have been developed to interface with
SIM/SAM cards as defined by GSM1111 and ENV1375-1. The connectors are
available with either hinged covers or
fixed covers and have been designed to
minimize the amount of space needed
for PCB mounting.
Features
Hinged Cover
• Available with 6 or 8 contacts, with or
without PCB locating pegs.
• Available with card presence switch.
• The cover springs open when
unlocked while the card is in place.
• The molding is polarized so that the
cover can only be closed if the card is
correctly inserted.
• The cover can be replaced without
removing the connector from the PCB
Construction
Contacts
Plating
Copper alloy
Contact area : Gold alloy inlay
Terminals : Tin lead (2µ min)
High temp. thermoplastic UL 94V-0 rated
Stainless steel
Moldings
Spring
Mechanical data
Number of Contacts
Mechanical life, hinged cover
Mechanical life, fixed cover
Durability of inlay, hinged cover
Durability of inlay, fixed cover
Card insertion force
Card extraction force
Contact force
Slide locking force
Vibration
Shock
• Inspection slots allow an electrical test
to be made without opening the cover.
• The overall height of the connector is
only 2.5 mm. The amount of space
needed to mount the connector is just
29.65 mm x 17.2 mm
Electrical data
Insulation resistance
Contact resistance max
Switching current
Dielectric strength
6 or 8
10,000 cycles min
50,000 cycles
10,000 cycles min (see note 1)
5,000 cycles
Hinged cover: 1 N max
Fixed cover: 3 N max
Hinged cover: 1 N max
Fixed cover: 0.80 N min / 3 N max
0.25 N min / 0.50 N max
2 N min / 6 N max
Frequency 10 to 500 Hz. Acceleration 50m/s2
Duration 6 hours - amplitude 0.35 mm
Max electrical discontinuity 1µs
Peak value 500 m/s2 – Duration 11 ms
3 shocks in each direction of each axis
Max electrical discontinuity 1 µs
1,000 MΩ min
100 mΩ max
10 µA min / 1 A max
750 Vrms min
Fixed Cover
• Available with 6 or 8 contacts.
• The overall height of the connector is
2.85 mm max. Only 25.5 mm x 17.2
mm of board space is required to
mount the connector.
General
• With tape and reel packaging as
standard, the connectors are designed
to be automatically pick-and-placed.
Environmental data
Operating temperature
Soldering temperature
Damp heat
Salt mist
-40°C to +85°C
Temperature/time profile acc. to CECC00802
para. 6.1, Fig. 3 with peak temperature 250°C
IEC 512 test number 11c (10 days)
IEC 512 test number 11f (96 hours)
Note 1: Inlay (precious metal) rating is based on a very abrasive card being used and is
intended to represent worst case.
• The high temperature thermoplastic
moldings are suited for infrared and
convection soldering processes.
• By using an inlay finish in the contact
area the life of the precious metal is
extended by over 10 times that of
standard gold plating.
• Robustly formed printed circuit tails
allow a co-planarity of ±0.05 mm to
be maintained.
Dimensions are shown in mm
Dimensions subject to change
www.ittcannon.com/ccm
27
