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部品型式

HM1-7661-5

製品説明
仕様・特性

Connection Systems Two-Piece Backplanes 2mm Hard Metric 8+2 Connectors Description: Modular, high-density, two-piece backplane connection system Typical Applications: Servers Switches Routers Add/drop multiplexers Benefits/Features: Industry Standard . . Meets IEC 61076-4-101 performance requirements and extends mounting, mating and other specifications from the 5+2 series. Versatility . . . . . . . . Configurations similar to the 5+2 series allow mix-and-match to create solutions to complex I/O requirements. Three mating length pins allow thousands of early mate, last break options and reduced mating force. Integrated shielding available to minimize EMI. Extended tails available for through the backplane I/O. mates-last, breaks-first awkward? Flexible code-key indexing for user-defined slot discrimination. Reliability . . . . . . . . Generous lead-in allows self-alignment for blind mating. Minimum contact wipe of 2mm for all pin lengths. Mechanical and Electrical Characteristics: Mechanical Specifications Electrical Performance Grid Size 2.0 mm Current Rating 1 amp Temperature Range -55°C to +105°C Voltage Rating 30 VAC Insulation Material Glass filled polymer, UL94V-0 Insulation Resistance Initial: 10,000 MΩ Dielectric Withstanding Voltage 750 VAC Contact Base Material Phosphor bronze Creepage and Clearance Distance 0.40 mm contact row 0.40 mm adjacent contacts Recommended PCB Plated Through Holes Contact Levels 5.3, 6.8, 8.3 mm Drilled Hole 0.69 - 0.72 mm Tail Lengths (±0.3) 3.7, 13.0, 14.5, 16.0 mm Cu 0.25 µm min. Mating Force per Signal Contact 0.75 N [0.169 lbf] max. Sn 0.10 µm max. Plated Through Hole 0.55 - 0.65 mm Unmating Force 0.12 N [0.027 lbf] min. Termination Technique Press-fit Misalignment 2.0 mm Inclination Longitudinal: ±2° Transverse: ±2° Performance Class 1 500 mating cycles 2 250 mating cycles

ブランド

HARRIS

会社名

Harris Semiconductor

事業概要

供給状況

 
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