MC33077
Low Noise Dual Operational
Amplifier
The MC33077 is a precision high quality, high frequency, low noise
monolithic dual operational amplifier employing innovative bipolar
design techniques. Precision matching coupled with a unique analog
resistor trim technique is used to obtain low input offset voltages.
Dual−doublet frequency compensation techniques are used to enhance
the gain bandwidth product of the amplifier. In addition, the MC33077
offers low input noise voltage, low temperature coefficient of input
offset voltage, high slew rate, high AC and DC open loop voltage gain
and low supply current drain. The all NPN transistor output stage
exhibits no deadband cross−over distortion, large output voltage
swing, excellent phase and gain margins, low open loop output
impedance and symmetrical source and sink AC frequency
performance.
The MC33077 is available in plastic DIP and SOIC−8 packages (P
and D suffixes).
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MARKING
DIAGRAMS
8
SOIC−8
D SUFFIX
CASE 751
8
1
33077
ALYW
1
8
PDIP−8
P SUFFIX
CASE 626
8
Features
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http://onsemi.com
MC33077P
AWL
YYWW
1
Low Voltage Noise: 4.4 nV/ ǸHz @ 1.0 kHz
Low Input Offset Voltage: 0.2 mV
Low TC of Input Offset Voltage: 2.0 mV/°C
High Gain Bandwidth Product: 37 MHz @ 100 kHz
High AC Voltage Gain: 370 @ 100 kHz
1850 @ 20 kHz
Unity Gain Stable: with Capacitance Loads to 500 pF
High Slew Rate: 11 V/ms
Low Total Harmonic Distortion: 0.007%
Large Output Voltage Swing: +14 V to −14.7 V
High DC Open Loop Voltage Gain: 400 k (112 dB)
High Common Mode Rejection: 107 dB
Low Power Supply Drain Current: 3.5 mA
Dual Supply Operation: ±2.5 V to ±18 V
Pb−Free Package is Available
1
A
WL, L
YY, Y
WW, W
= Assembly Location
= Wafer Lot
= Year
= Work Week
PIN CONNECTIONS
Output 1 1
8 VCC
−
2
7 Output 2
1
+
Inputs 1
3
−
6
2
Inputs 2
+
VEE 4
5
(Dual, Top View)
ORDERING INFORMATION
Device
Package
Shipping†
MC33077D
SOIC−8
98 Units/Rail
MC33077DR2
SOIC−8
2500 Tape & Reel
SOIC−8
(Pb−Free)
2500 Tape & Reel
PDIP−8
50 Units/Rail
MC33077DR2G
MC33077P
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004
March, 2004 − Rev. 5
1
Publication Order Number:
MC33077/D