MMFT2955E
Preferred Device
Power MOSFET
1 Amp, 60 Volts
P−Channel SOT−223
This Power MOSFET is designed to withstand high energy in the
avalanche and commutation modes. This new energy efficient device
also offers a drain−to−source diode with a fast recovery time.
Designed for low voltage, high speed switching applications in power
supplies, converters and PWM motor controls, these devices are
particularly well suited for bridge circuits where diode speed and
commutating safe operating areas are critical and offer additional
safety margin against unexpected voltage transients. The device is
housed in the SOT−223 package which is designed for medium power
surface mount applications.
http://onsemi.com
1 AMPERE, 60 VOLTS
RDS(on) = 300 mW
P−Channel
D
Features
G
• Silicon Gate for Fast Switching Speeds
• The SOT−223 Package can be Soldered Using Wave or Reflow
• The Formed Leads Absorb Thermal Stress During Soldering,
•
Eliminating the Possibility of Damage to the Die
Pb−Free Package is Available
Symbol
4
1
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
S
Value
Drain−to−Source Voltage
VDS
60
Gate−to−Source Voltage − Continuous
VGS
±15
Drain Current − Continuous
Drain Current − Pulsed
ID
IDM
Total Power Dissipation @ TA = 25°C
Derate above 25°C
Unit
2
TO−261AA
CASE 318E
STYLE 3
3
MARKING DIAGRAM AND
PIN ASSIGNMENT
Vdc
4 Drain
1.2
4.8
Adc
PD
(Note 1)
0.8
6.4
W
mW/°C
AYW
2955E G
G
Operating and Storage Temperature Range
TJ, Tstg
−65 to 150
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 25 V, VGS = 10 V, Peak
IL= 1.2 A, L = 0.2 mH, RG = 25 W)
EAS
108
mJ
RqJA
156
°C/W
TL
260
°C
Device
Package
10
S
MMFT2955ET1
SOT−223
1000 Tape & Reel
MMFT2955ET1G
SOT−223
(Pb−Free)
1000 Tape & Reel
MMFT2955ET3
SOT−223
4000 Tape & Reel
THERMAL CHARACTERISTICS
Thermal Resistance, Junction−to−Ambient
(surface mounted)
Maximum Temperature for Soldering
Purposes,
Time in Solder Bath
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Power rating when mounted on FR−4 glass epoxy printed circuit board using
recommended footprint.
1
Gate
2
Drain
3
Source
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
2955E = Device Code
(Note: Microdot may be in either location)
ORDERING INFORMATION
Shipping†
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2006
August, 2006 − Rev. 7
1
Publication Order Number:
MMFT2955E/D
