MMSZ52xxBT1 Series,
SZMMSZ52xxBT1G Series
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
http://onsemi.com
Features
•
•
•
•
•
•
•
•
•
500 mW Rating on FR−4 or FR−5 Board
Wide Zener Reverse Voltage Range − 2.4 V to 110 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
General Purpose, Medium Current
ESD Rating of Class 3 (>16 kV) per Human Body Model
AEC−Q101 Qualified and PPAP Capable
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
Pb−Free Packages are Available
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
Total Power Dissipation on FR−5 Board,
(Note 1) @ TL = 75°C
Derated above 75°C
SOD−123
CASE 425
STYLE 1
2
1
MARKING DIAGRAM
1
xx MG
G
xx = Device Code (Refer to page 3)
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PD
Shipping†
MMSZ52xxBT1
Symbol
Package
SOD−123
3000 / Tape &
Reel
MMSZ52xxBT1G
SOD−123
(Pb−Free)
3000 / Tape &
Reel
SZMMSZ52xxBT1G
SOD−123
(Pb−Free)
3000 / Tape &
Reel
MMSZ52xxBT3
SOD−123
10000 / Tape &
Reel
MMSZ52xxBT3G
SOD−123
(Pb−Free)
10000 / Tape &
Reel
SZMMSZ52xxBT3G
SOD−123
(Pb−Free)
10000 / Tape &
Reel
Device
Max
Unit
500
6.7
mW
mW/°C
Thermal Resistance, Junction−to−Ambient
(Note 2)
RqJA
340
°C/W
Thermal Resistance, Junction−to−Lead
(Note 2)
RqJL
150
°C/W
TJ, Tstg
−55 to +150
Junction and Storage Temperature Range
2
Anode
ORDERING INFORMATION
MAXIMUM RATINGS
Rating
1
Cathode
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.
2. Thermal Resistance measurement obtained via infrared Scan Method.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
© Semiconductor Components Industries, LLC, 2011
November, 2011 − Rev. 10
1
Publication Order Number:
MMSZ5221BT1/D
