MOSSTYLECHIPCAPACITORS
MSCC 2 - MSCC 4
MSCC SERIES
MSCC-2
L
SIZE
CAPACIT
ACITANCE VALUES
CAPACITANCE VALUES (pF)
W
TOLERANCES
MSCC 5
0.020" x 0.020" (±0.003") x 0.010" (±0.001")
4.7
5.6
6.8
8.2
12
13
15
16
22
24
27
30
39
43
47
51
pF
4.7 - 10
11 - 20
21 - 51
10
18
33
11
20
36
TOLERANCE(S)
±0.5pF
5%, 10%, 20%
2.5%, 5%, 10%, 20%
MSCC-3
SIZE
CAPACIT
ACITANCE VALUES
CAPACITANCE VALUES (pF)
L
pF
33 - 100
TOLERANCES
WORKING VOLTAGE (V)
WORKING VOLTAGE (V)
WORKING VOLTAGE (V)
TOLERANCES
56
TOLERANCE(S)
2.5%, 5%, 10%, 20%
0.040" x 0.040" (±0.003") x 0.010" (±0.001")
56
62
68
75
100
110
120
130
180
200
220
pF
56 - 220
82
150
91
160
TOLERANCE(S)
2.5%, 5%, 10%, 20%
MSCC-5
6.8
10
12 15 18
22 27
CAPACITANCE (pF)
33
39
SIZE
CAPACIT
ACITANCE VALUES
CAPACITANCE VALUES (pF)
47
MSCC 3
WORKING VOLTAGE vs CAPACITANCE
250
225
200
175
150
125
100
75
50
25
0
56
TOLERANCES
0.055" x 0.055" (±0.003") x 0.010" (±0.001")
150
160
180
200
270
300
330
360
470
510
560
620
820
910
1000
pF
150 - 1000
220
390
680
240
430
750
TOLERANCE(S)
2.5%, 5%, 10%, 20%
DAT
COMMON SERIES DATA
33
36
39
43
47 51 56 62 68
CAPACITANCE (pF)
75
82
91 100
MSCC 4
WORKING VOLTAGE vs CAPACITANCE
68
82
100
120
CAPACITANCE (pF)
150
180
220
MSCC 5
WORKING VOLTAGE vs CAPACITANCE
250
225
200
175
150
125
100
75
50
25
0
150 180 220 270 330 390 470 560 680 820 1000
CAPACITANCE (pF)
SUBSTRATE
SUBSTRATE
DIELECTRIC
PAD
BOND PAD
BACKSIDE
T.C.C.
OPERATING TEMPERATURE
OPERATING TEMPERATURE RANGE
DISSIPA
FACTOR
DISSIPATION FACTOR
Q
INSULATION RESISTANCE
INSULATION RESISTANCE
RESISTANCE
MOISTURE RESISTANCE
THERMAL SHOCK
TEMPERATURE
HIGH TEMPERATURE EXPOSURE
SHORT TERM OVERLOAD
STABILITY
STABILITY
SILICON
SILICON OXIDE
STANDARD;
GOLD STANDARD; ALUMINUM OPTIONAL
SUITABLE
ATT
TTA
GOLD, SUITABLE FOR EUTECTIC OR CONDUCTIVE EPOXY ATTATCH
+45ppm/°C, ±25ppm/°C
-55°C TO +150°C
1Vrms,
1KHz, 1Vrms, 25°C, 0.1%
1MHz, 50Vrms, 25°C, 1000 MIN.
50Vrms,
VOLT
@ WORKING VOLTAGE, 109 Ω
MIL-STD 202, METHOD 106, ∆ C:
GREATER
±1pF OR 2% ∆ C MAX., WHICHEVER IS GREATER
107F,
MIL-STD 202, METHOD 107F, ∆ C:
±0.5pF MAX., MSI TYPICAL ±0.1pF
150°C, 100 HRS., ∆ C:
GREATER
±0.5pF OR 1% ∆ C MAX., WHICHEVER IS GREATER
1.5X
VOLT
1.5X WORKING VOLTAGE, 5 SEC., ∆ C:
GREATER
±0.5pF OR 1% ∆ C MAX., WHICHEVER IS GREATER
70°C,
VOLT
1000 HRS., 70°C, @ WORKING VOLTAGE ∆ C:
±2.5%
GREATER
±2.5pF OR ±2.5% MAX. ∆ C, WHICHEVER IS GREATER
PART NUMBER DESIGNATION
DESIGNATION
MSCC
THIN FILM DIVISION
20 DAVID ROAD, N. ATTLEBORO, MA 02760
DAVID
ATTLEBORO,
508-695-0203 FAX: 508-695-6076
DCN TF 114-F-0306
X
SA
XXXXX
SERIES
MINI-SYSTEMS, INC.
CHIP
CHIP
CHIP
CHIP
CHIP
CAPACITORS
CAPACITORS
CAPACITORS
CAPACITORS
CAPACITORS
WORKING VOLTAGE (V)
SIZE
CAPACIT
ACITANCE VALUES
CAPACITANCE VALUES (pF)
MSCC 2
WORKING VOLTAGE vs CAPACITANCE
250
225
200
175
150
125
100
75
50
25
0
51
100
MSCC-4
W
250
225
200
175
150
125
100
75
50
25
0
4.7
0.030" x 0.030" (±0.003") x 0.010" (±0.001")
33
36
39
43
47
62
68
75
82
91
SIZE
2
3
4
5
TYPE
CAPACIT
ACITANCE VALUE
CAPACITANCE VALUE
5-Digit Number: First 4 Digits
Are Significant
With "R" As Decimal Point
When Required.
5th Digit Represents
Number of Zeros.
EXAMPLE: MSCC5SA-510R0H-E = 0.055" x 0.055", Silicon Substrate,
510pF,
Tol.,
510pF, ±2.5% Tol., Aluminum Pads
X
X
TOL.
OPTION
±0.5p
*A =±0.5 p F
E = Aluminum Pads
H = 2.5%
G = Gold Pads
5%
J=
K = 10%
M = 20%
* Use for MSCC-2
4.7pF to 10pF
