MSP
Vishay Dale
Thick Film Resistor Networks
Single-In-Line, Molded SIP; 01, 03, 05 Schematics
6, 8, 9 or 10 Pin "A" Profile and 6, 8 or 10 Pin "C" Profile
FEATURES
• 0.195" [4.95mm] "A" or 0.350" [8.89mm] "C" maximum seated
height
• Highly stable thick film
• Low temperature coefficient (- 55°C to + 125°C) ± 100ppm/°C
• Rugged, molded case construction
• Reduces total assembly costs
• Compatible with automatic insertion equipment and reduces PC
board space
• Wide resistance range
• Available in tube pack or side-by-side pack
STANDARD ELECTRICAL SPECIFICATIONS
MODEL/
SCHEMATIC
PROFILE
RESISTOR
POWER RATING
Max. @ 70°C*
W
RESISTANCE
RANGE
Ω
±%
MSP01
A
C
0.20
0.25
10 - 2.2M
2 Standard
(1, 5, 10, 20)**
± 100
± 50ppm/°C
100
MSP03
A
C
0.30
0.40
10 - 2.2M
2 Standard
(1, 5, 10, 20)**
± 100
± 50ppm/°C
100
10 - 2.2M
± 2 Standard
(± 5%)**
± 100
± 150ppm/°C
100
MSP05
A
0.20
C
0.25
* Tighter tracking available
** Tolerances in brackets available on request
STANDARD
TOLERANCE
TEMPERATURE
TCR
COEFFICIENT
TRACKING*
(- 55°C to + 125°C) (- 55°C to + 125°C)
ppm/°C
ppm/°C
OPERATING
VOLTAGE
Max.
VDC
TECHNICAL SPECIFICATIONS
PARAMETER
UNIT
MSP SERIES
Package Power Rating
See Derating Curves
(Maximum at + 25°C and + 70°C
Voltage Coefficient of Resistance
Veff
< 50ppm typical
VAC
200
Isolation Resistance (03 Schematic)
Ω
> 100M
Operating Temperature Range
°C
- 55 to + 125
Storage Temperature Range
°C
- 55 to + 150
Dielectric Strength
MECHANICAL SPECIFICATIONS
Marking Resistance to Solvents:
Permanency testing per MIL-STD-202, Method 215.
Solderability:
Per MIL-STD-202, Method 208E, RMA flux.
Body:
Molded epoxy.
Terminals:
Copper alloy, tin-lead plated.
Weight:
MSP06A = 0.4 gram
MSP08A = 0.5 gram
MSP09A = .55 gram
MSP10A = 0.6 gram
www.vishay.com
38
MSP06C = 0.7 gram
MSP08C = 0.9 gram
MSP10C = 1.1 gram
For Technical Questions, contact: ff2aresistors@vishay.com
Document Number: 31510
Revision 25-Oct-00
