MUN5211T1 SERIES
Preferred Devices
Bias Resistor Transistor
NPN Silicon Surface Mount Transistor
with Monolithic Bias Resistor Network
This new series of digital transistors is designed to replace a single
device and its external resistor bias network. The BRT (Bias Resistor
Transistor) contains a single transistor with a monolithic bias network
consisting of two resistors; a series base resistor and a base–emitter
resistor. The BRT eliminates these individual components by
integrating them into a single device. The use of a BRT can reduce
both system cost and board space. The device is housed in the
SC–70/SOT–323 package which is designed for low power surface
mount applications.
•
•
•
•
•
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
The SC–70/SOT–323 package can be soldered using
wave or reflow. The modified gull–winged leads absorb
thermal stress during soldering eliminating the possibility
of damage to the die.
Available in 8 mm embossed tape and reel
Use the Device Number to order the 7 inch/3000 unit reel.
Replace “T1” with “T3” in the Device Number to order
the 13 inch/10,000 unit reel.
http://onsemi.com
NPN SILICON
BIAS RESISTOR
TRANSISTORS
PIN3
COLLECTOR
(OUTPUT)
R1
PIN1 R2
BASE
(INPUT)
PIN2
EMITTER
(GROUND)
3
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Collector-Base Voltage
VCBO
50
Vdc
Collector-Emitter Voltage
VCEO
50
Vdc
Collector Current
IC
100
mAdc
Total Power Dissipation
@ TA = 25°C (1.)
Derate above 25°C
PD
150
1.2
mW
mW/°C
1
2
CASE 419
SC–70/SOT–323
STYLE 3
DEVICE MARKING AND RESISTOR VALUES
Device
MUN5211T1
MUN5212T1
MUN5213T1
MUN5214T1
MUN5215T1 (2.)
MUN5216T1 (2.)
MUN5230T1 (2.)
MUN5231T1 (2.)
MUN5232T1 (2.)
MUN5233T1 (2.)
MUN5234T1 (2.)
MUN5235T1 (2.)
Marking
R1 (K)
R2 (K)
Shipping
8A
8B
8C
8D
8E
8F
8G
8H
8J
8K
8L
8M
10
22
47
10
10
4.7
1.0
2.2
4.7
4.7
22
2.2
10
22
47
47
∞
∞
1.0
2.2
4.7
47
47
47
Preferred devices are recommended choices for future use
and best overall value.
3000/Tape & Reel
1. Device mounted on a FR–4 glass epoxy printed circuit board using the
minimum recommended footprint.
2. New devices. Updated curves to follow in subsequent data sheets.
© Semiconductor Components Industries, LLC, 2000
May, 2000 – Rev. 3
1
Publication Order Number:
MUN5211T1/D
