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PM82200T

製品説明
仕様・特性

1PMT4621e3 thru 1PMT4627e3, 1PMT4100e3 thru 1PMT4135e3 Available POWERMITETM Low Noise 1 Watt Zener Diodes DESCRIPTION This Microsemi Powermite® surface mount low noise Zener package series provides a higher power handling capability that are also RoHS compliant. In addition to its size advantages, ® Powermite package features include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment. Important: For the latest information, visit our website http://www.microsemi.com. FEATURES • • • • • • Surface mount equivalent to JEDEC registered 1N4100 thru 1N4135 and 1N4621 thru 1N4627 series except with additional power capability. Extensive selection from 1.8 to 100 volts. Regulates voltage over a broad operating current and temperature range. Low noise density (1-3 kHz) at test current. Low reverse leakage current. RoHS compliant versions available. APPLICATIONS / BENEFITS • • • • • DO-216 Package Also available in: DO-35 package (axial-leaded) 1N4099 – 1N4135 and 1N4614 – 1N4627 DO-213AA package (surface mount) 1N4099UR – 1N4135UR and 1N4614UR – 1N4627UR Tight tolerances available in plus or minus 2% with C suffix respectively. Moisture classification Level 1 per IPC/JEDEC J-STD-020B with no dry pack required. Non-sensitive to ESD per MIL-STD-750 method 1020. Compatible with automatic insertion equipment. Full metallic bottom eliminates flux entrapment. MAXIMUM RATINGS Parameters/Test Conditions Junction and Storage Temperature (1) Thermal Resistance Junction-to-Ambient Thermal Resistance Junction-to-Case (2) Steady-State Power Dissipation Forward Voltage @ 200 mA Solder Temperature @ 10 s Notes: 1. 2. Symbol Value TJ and TSTG R ӨJA R ӨJC PD VF TSP -55 to +150 240 30 1.0 1.1 260 Unit o C C/W o C/W W V o C o On FR4 PC board (1 oz copper) with recommended footprint (see last page). At T C < 120 oC where T C is case bottom temperature at mounting plane, or 0.5 watts at T A = 30 ºC (ambient temperature) when mounted on FR4 PC board as described for thermal resistance (also see power deratings in Figure 2). MSC – Lawrence 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 or (978) 620-2600 Fax: (978) 689-0803 MSC – Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com T4-LDS-0245-1, Rev. 1 (120179) ©2012 Microsemi Corporation Page 1 of 5

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