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部品型式

PZT2907AT1

製品説明
仕様・特性

PZT2907AT1, SPZT2907AT1G Preferred Device PNP Silicon Epitaxial Transistor This PNP Silicon Epitaxial transistor is designed for use in linear and switching applications. The device is housed in the SOT-223 package which is designed for medium power surface mount applications. http://onsemi.com Features SOT−223 CASE 318E STYLE 1  NPN Complement is PZT2222AT1  The SOT-223 package can be soldered using wave or reflow  SOT-223 package ensures level mounting, resulting in improved    thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering eliminating the possibility of damage to the die. AEC−Q101 Qualified and PPAP Capable S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements Pb−Free Packages are Available* COLLECTOR 2, 4 1 BASE 3 EMITTER MARKING DIAGRAM MAXIMUM RATINGS Symbol Value Unit Collector −Emitter Voltage Rating VCEO −60 Vdc Collector −Base Voltage VCBO −60 Vdc Emitter −Base Voltage VEBO −5.0 Vdc IC −600 mAdc Symbol Max Unit PD 1.5 12 W mW/C RqJA 83.3 C/W Collector Current − Continuous THERMAL CHARACTERISTICS Characteristic Total Device Dissipation (Note 1) TA = 25C Thermal Resistance Junction−to−Ambient (Note 1) Lead Temperature for Soldering, 0.0625 from case Time in Solder Bath Operating and Storage Temperature Range AYW P2F G G 1 P2F A Y W G (Note: Microdot may be in either location) ORDERING INFORMATION Package Shipping† PZT2907AT1 SOT−223 1,000 / Tape & Reel PZT2907AT1G SOT−223 (Pb−Free) 1,000 / Tape & Reel SPZT2907AT1G SOT−223 (Pb−Free) 1,000 / Tape & Reel PZT2907AT3 SOT−223 4,000 / Tape & Reel PZT2907AT3G SOT−223 (Pb−Free) 4,000 / Tape & Reel Device TL TJ, Tstg 260 10 C Sec −65 to +150 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−4 with 1 oz and 713 mm2 of copper area. = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.  Semiconductor Components Industries, LLC, 2011 November, 2011 − Rev. 9 1 Preferred devices are recommended choices for future use and best overall value. Publication Order Number: PZT2907AT1/D

ブランド

MOT

現況

1999年8月4日、ディスクリート・標準アナログ・標準ロジックなどの半導体部門をオン・セミコンダクターとして分社化した。これは、イリジウムコミュニケーションズ倒産の損失をカバーするために分社化された。

会社名

ON Semiconductor

本社国名

U.S.A

事業概要

オン・セミコンダクターの前身は、モトローラ社の半導体コンポーネント・グループであり、モトローラ社のディスクリート、標準アナログ、標準ロジック・デバイスを継続して製造。

供給状況

 
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