PZT2907AT1,
SPZT2907AT1G
Preferred Device
PNP Silicon
Epitaxial Transistor
This PNP Silicon Epitaxial transistor is designed for use in linear
and switching applications. The device is housed in the SOT-223
package which is designed for medium power surface mount
applications.
http://onsemi.com
Features
SOT−223
CASE 318E
STYLE 1
NPN Complement is PZT2222AT1
The SOT-223 package can be soldered using wave or reflow
SOT-223 package ensures level mounting, resulting in improved
thermal conduction, and allows visual inspection of soldered joints.
The formed leads absorb thermal stress during soldering eliminating
the possibility of damage to the die.
AEC−Q101 Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
Pb−Free Packages are Available*
COLLECTOR
2, 4
1
BASE
3
EMITTER
MARKING DIAGRAM
MAXIMUM RATINGS
Symbol
Value
Unit
Collector −Emitter Voltage
Rating
VCEO
−60
Vdc
Collector −Base Voltage
VCBO
−60
Vdc
Emitter −Base Voltage
VEBO
−5.0
Vdc
IC
−600
mAdc
Symbol
Max
Unit
PD
1.5
12
W
mW/C
RqJA
83.3
C/W
Collector Current − Continuous
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation (Note 1)
TA = 25C
Thermal Resistance Junction−to−Ambient
(Note 1)
Lead Temperature for Soldering,
0.0625 from case
Time in Solder Bath
Operating and Storage Temperature Range
AYW
P2F G
G
1
P2F
A
Y
W
G
(Note: Microdot may be in either location)
ORDERING INFORMATION
Package
Shipping†
PZT2907AT1
SOT−223
1,000 / Tape & Reel
PZT2907AT1G
SOT−223
(Pb−Free)
1,000 / Tape & Reel
SPZT2907AT1G
SOT−223
(Pb−Free)
1,000 / Tape & Reel
PZT2907AT3
SOT−223
4,000 / Tape & Reel
PZT2907AT3G
SOT−223
(Pb−Free)
4,000 / Tape & Reel
Device
TL
TJ, Tstg
260
10
C
Sec
−65 to
+150
C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 with 1 oz and 713 mm2 of copper area.
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2011
November, 2011 − Rev. 9
1
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
PZT2907AT1/D