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部品型式

TE28F008B3T-115

製品説明
仕様・特性

E PRELIMINARY SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE 8-MBIT (1024K x 8), 16-MBIT (2056K x 8) FLASH MEMORY FAMILY 28F008B3, 28F016B3 n n n n n n n n n Flexible SmartVoltage Technology  2.7V–3.6V Program/Erase  2.7V–3.6V Read Operation  12V VPP Fast Production Programming 2.7V or 1.8V I/O Option  Reduces Overall System Power Optimized Block Sizes  Eight 8-Kbyte Blocks for Data, Top or Bottom Locations  Up to Thirty-One 64-Kbyte Blocks for Code High Performance  2.7V–3.6V: 120 ns Max Access Time Block Locking  VCC-Level Control through WP# Low Power Consumption  20 mA Maximum Read Current Absolute Hardware-Protection  VPP = GND Option  VCC Lockout Voltage Extended Temperature Operation  –40°C to +85°C n n n n n n n n n Extended Cycling Capability  10,000 Block Erase Cycles Automated Byte Program and Block Erase  Command User Interface  Status Registers SRAM-Compatible Write Interface Automatic Power Savings Feature Reset/Deep Power-Down  1 µA ICCTypical  Spurious Write Lockout Standard Surface Mount Packaging  48-Ball µBGA* Package  40-Lead TSOP Package Footprint Upgradeable  Upgradeable from 2-, 4- and 8-Mbit Boot Block ETOX™ V (0.4 µ) Flash Technology x8-Only Input/Output Architecture  For Space-Constrained 8-bit Applications Supports Code plus Data Storage  Optimized for FDI, Flash Data Integrator Software  Fast Program Suspend Capability  Fast Erase Suspend Capability The new Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.4µ technology, represents a featurerich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7V read, program and erase) with high-speed, low-power operation. Several new features have been added, including the ability to drive the I/O at 1.8V, which significantly reduces system active power and interfaces to 1.8V controllers. A new blocking scheme enables code and data storage within a single device. Add to this the Intel-developed Flash Data Integrator (FDI) software and you have the most cost-effective, monolithic code plus data storage solution on the market today. Smart 3 Advanced Boot Block Byte-Wide products will be available in 40-lead TSOP and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing Intel’s WWW page: http://www.intel.com/design/flcomp May 1997 Order Number: 290605-001

ブランド

INTEL

会社名

Intel Corporation

本社国名

U.S.A

事業概要

マイクロプロセッサ・チップセット・フラッシュメモリなどの開発・製造・販売 世界CPU市場ではここ数年80%近いシェアを維持している。

供給状況

 
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