DIN Fine-fit Connectors with W-shaped Pins
XC5
International DIN standards; Solderless
Connection Series (Fine Fit)
■ Backplane systems can be designed with ease with
XC5 Connectors as conforming with DIN standards.
■ Using unique W-shaped pins, these Connectors prevent contacts from being bent or falling out.
Ensures highly reliable connections.
■ Less damage to the through-holes in circuit boards.
■ The XC6-series Connectors can be used as Backplane
Connectors.
■ Uses highly-reliable Twin-contact Sockets.
■ A special Press-fit Tool is available.
RoHS Compliant
■ Ratings and Characteristics
■ Applicable Wrap Post Wire Sizes
AWG30, AWG28, AWG26, or AWG24
(Solid wire: 0.25 to 0.51 mm dia.)
Rated current
2A
Rated voltage
300 VAC
Contact resistance
20 mΩ max. (at 20 mV, 100 mA max.)
■ Wrap Post Length
Insulation resistance 106 MΩ min. (at 100 VDC)
3 wires for the 13-mm contacts
4 wires for the 17-mm contacts
Dielectric strength
1,000 VAC for 1 min (leakage current:
1 mA max.)
■ Ratings for Fine-fit Connectors
Total insertion force
0.59 N max. per contact
Rated current
2A
Removal force
0.15 N max. (with test gauge, t = 0.56 mm)
Contact resistance
5 mΩ max. (at 20 mV, 100 mA max.)
Insertion durability
200 times
196 N max. per contact
Ambient operating
temperature
Operating: −55 to 125°C (with no icing)
Pressure input
Holding force
44.1 N min.
Unit torque durability 0.022 N-m min.
■ Materials and Finish
Vibration
Shock
At 100 G, will not break current for more
than 1 µ sec.
Type
Plugs
Housings
Fiber-glass reinforced PBT resin
(UL94V-0)/gray
Contacts
Mating
(See note.) end
Copper alloy/nickel base, 0.4-µm gold
plating
■ Applicable Fine-fit Boards
Fine fit
Copper alloy/nickel base, gold flash
plating
• Width 1.6 to 3.2 mm
Terminal
Copper alloy/nickel base, 0.15-µm gold
plating (See note.)
Note:
Sockets
At 10 to 2,000 Hz, 1.52-mm amplitude, or
15 G will not interrupt current for more
than 1 µ sec.
For non-standard plating specifications, contact your
OMRON representative.
• Through-hole diameter 1.0 ±0.08 mm (Drill diameter 1.15
±0.05 mm)
Plating: Copper 25 µm min., or solder 5 µm min. on a copper
base at least 25 µm thick.
• Pitch error: ±0.03 mm max.
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