BYV29, BYV29F, BYV29B, UG8GT, UGF8GT, UGB8GT Series
Vishay Semiconductors
formerly General Semiconductor
Ultrafast Rectifier
Reverse Voltage 300 to 400V
Forward Current 8.0A
Reverse Recovery Time 35ns
ITO-220AC (BYV29F, UGF8 Series)
0.188 (4.77)
0.172 (4.36)
0.405 (10.27)
0.383 (9.72)
0.110 (2.80)
0.100 (2.54)
TO-220AC (BYV29, UG8 Series)
0.140 (3.56)
DIA.
0.130 (3.30)
0.185 (4.70)
0.415 (10.54) MAX.
0.131 (3.39)
DIA.
0.122 (3.08)
0.175 (4.44)
0.154 (3.91)
0.370 (9.40)
0.360 (9.14)
0.148 (3.74)
DIA.
0.055 (1.39)
0.045 (1.14)
0.676 (17.2)
0.646 (16.4)
0.600 (15.5)
0.580 (14.5)
0.350 (8.89)
0.330 (8.38)
0.113 (2.87)
0.103 (2.62)
PIN
0.145 (3.68)
0.135 (3.43)
0.410 (10.41)
0.390 (9.91)
0.350 (8.89)
0.330 (8.38)
0.635 (16.13)
0.625 (15.87)
1
2
0.191 (4.85)
0.171 (4.35)
0.603 (15.32)
0.573 (14.55)
0.560 (14.22)
0.530 (13.46)
PIN
1
2
1.148 (29.16)
1.118 (28.40)
0.160 (4.06)
0.140 (3.56)
PIN 1
PIN 2
0.110 (2.79)
0.100 (2.54)
0.560 (14.22)
0.530 (13.46)
PIN 1
0.037 (0.94)
0.027 (0.69)
0.205 (5.20)
0.195 (4.95)
0.022 (0.55)
0.014 (0.36)
CASE
PIN 2
0.105 (2.67)
0.037 (0.94)
0.027 (0.68)
0.095 (2.41)
0.110 (2.80)
0.100 (2.54)
0.060 (1.52)
0.205 (5.20)
0.195 (4.95)
TO-263AB (BYV29B, UGB8 Series)
0.022 (0.56)
0.014 (0.36)
0.190 (4.83)
0.411 (10.45)
0.380 (9.65)
0.160 (4.06)
0.055 (1.40)
0.045 (1.14)
0.245 (6.22)
MIN
Mounting Pad Layout TO-263AB
K
0.42
(10.66)
0.33
(8.38)
Dimensions in inches
and (millimeters)
0.055 (1.40)
0.360 (9.14)
0.320 (8.13)
0.047 (1.19)
1
K
2
0.624 (15.85)
0.591 (15.00)
0-0.01 (0-0.254)
0.63
(17.02)
0.110 (2.79)
0.090 (2.29)
0.027 (0.686)
0.037 (0.940)
0.105 (2.67)
0.08
(2.032)
0.24
(6.096)
0.12
(3.05)
0.095 (2.41)
0.021 (0.53)
0.014 (0.36)
PIN 1
PIN 2
0.205 (5.20)
K - HEATSINK
0.140 (3.56)
0.110 (2.79)
0.195 (4.95)
Features
Mechanical Data
• Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
• Ideally suited for freewheeling diode power factor
correction applications
• Soft recovery characteristics
• Excellent high temperature switching
• Optimized to reduce switching losses
• High temperature soldering in accordance with
CECC 802 / Reflow guaranteed
• Glass passivated chip junction
Case: JEDEC TO-220AC, ITO-220AC & TO-263AB
molded plastic body
Terminals: Plated leads, solderable per MIL-STD-750,
Method 2026
Polarity: As marked
Mounting Position: Any
Mounting Torque: 5 in-lbs maximum
Weight: 0.08 oz., 2.24 g
Document Number 88557
03-Jul-02
www.vishay.com
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