C SERIES | Conductive Epoxy
TDK’s Conductive Epoxy Series is a conductive glue-mounted device
rather than solder-mounted.
In high-temperature environments, the
connectivity reliability is focused on the solder fillet because there are thermal
expansion coefficient differences between the substrate, MLCC, and solder
fillet. A conductive glue-mounted device allows for more “flexibility” during
periods of expansion and contraction because the thermal expansion
differences have been reduced by using a non-solder attachment.
Conductive glue is a common method of mounting components in
applications that demand reliability at high temperatures, particularly in
automotive environments. It's also used in applications that cannot be
subjected to the heat of the solder paste mounting process, such as LCD
panels, organic EL and LED displays, and CCD devices, which are particularly
sensitive to high temperatures.
L
B
B
W
L
W
T
B
T
Body Length
Body Width
Body Height
Terminal Width
Case Code
L (mm)
W (mm)
T (mm)
C1005/0402
1.00
0.50
0.50
C1608/0603
1.60
0.80
0.80
C2012/0805
2.00
1.25
1.25
C3216/1206
3.20
1.60
1.60
C3225/1210
3.20
2.50
2.50
Part Number Description
PACKAGING STYLE
TEMPERATURE CHARACTERISTICS
INTERNAL CODES
RATED VOLTAGE (DC)
C3216
X7R
1E
106
K
T
SERIES NAME & DIMENSION CODE
���B
CAPACITANCE TOLERANCE
NOMINAL CAPACITANCE (pF)
Features:
3
AgPdCu termination for conductive glue mounting
Reduce risk of silver migration
Improved mechanical/thermal strength when use with conductive glue
AEC Q-200 compliant
RoHS, WEE, and REACH compliant
Applications:
AgPdCu Termination
Standard Termination
1
Transmission control
Engine sensor module
Automotive power train
Anti-Lock Breaking System
Application requiring conductive glue mounting method
No.
NAME
(1)
(2)
(3)
(4)
(5)
Ceramic Dielectric
Internal Electrode
Termination
4
3
5
2
MATERIAL
Class 1
Class 2
CaZrO3
BaTiO3
Nickel (Ni)
Copper (Cu)
Nickel (Ni)
Tin (Sn)
©TDK Corporation of America – Contents are subject to change without notice.
1
No.
NAME
(1)
(2)
(3)
(4)
Ceramic Dielectric
Internal Electrode
Termination
4
2
MATERIAL
Class 1
Class 2
CaZrO3
BaTiO3
Nickel (Ni)
Copper (Cu)
AgPdCu
