NTD5805N, NVD5805N
Power MOSFET
40 V, 51 A, Single N−Channel, DPAK
Features
•
•
•
•
•
Low RDS(on)
High Current Capability
Avalanche Energy Specified
NVD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
http://onsemi.com
RDS(on) MAX
V(BR)DSS
16 mW @ 5.0 V
40 V
51 A
9.5 mW @ 10 V
D
Applications
•
•
•
•
ID MAX
LED Backlight Driver
CCFL Backlight
DC Motor Control
Power Supply Secondary Side Synchronous Rectification
N−Channel
G
S
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
4
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
40
V
Gate−to−Source Voltage − Continuous
VGS
±20
V
3
Gate−to−Source Voltage
− Non−Repetitive (tp < 10 mS)
VGS
±30
V
ID
51
A
DPAK
CASE 369C
(Surface Mount)
STYLE 2
MARKING DIAGRAM
& PIN ASSIGNMENT
TC = 25°C
Steady
State
Power Dissipation
(RqJC) (Note 1)
Pulsed Drain Current
TC = 100°C
TC = 25°C
tp = 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
Energy (VDD = 50 V, VGS = 10 V, RG = 25 W,
IL(pk) = 40 A, L = 0.1 mH, VDS = 40 V)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
36
PD
47
W
IDM
85
A
TJ, Tstg
−55 to
175
°C
IS
30
A
EAS
80
mJ
TL
260
4
Drain
AYWW
58
05NG
Continuous Drain
Current (RqJC)
(Note 1)
1 2
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
2
1 Drain 3
Gate Source
A
Y
WW
5805N
G
= Assembly Location*
= Year
= Work Week
= Device Code
= Pb−Free Package
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
Junction−to−Case (Drain)
RqJC
3.2
°C/W
Junction−to−Ambient − Steady State (Note 1)
RqJA
107
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.
1. Surface−mounted on FR4 board using the minimum recommended pad size.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 5
1
Publication Order Number:
NTD5805N/D
