LOP/SLP Series - “low profile“ Sockets & Strips
2,54mm pitch
Low profile DIP sockets
LOP Series
Low profile strips
height above PCB 2.41mm / .095"
height above PCB 2.41mm / .095"
Dimensions
Pin
Insulator
SLP Series
Ordering Code
mm/inch
"A"
14
20,32/.800
18
22,86/.900
20
30,48/1.200
28
35,56/1.400
32
40,64/1.600
40
50,80/2.000
10
LOP - 624 - S083 - 01
LOP - 628 - S083 - 01
15,24
.600
LOP - 632 - S083 - 01
LOP - 640 - S083 - 01
30,48/1.200
24
15,24
.600
25,40/1.000
24
7,62
.300
LOP - 314 - S083 - 01
LOP - 316 - S083 - 01
LOP - 318 - S083 - 01
LOP - 320 - S083 - 01
LOP - 324 - S083 - 01
17,78/.700
16
"B"
25,40/1.000
14
SLP - 110 - S083 - 01
35,56/1.400
SLP - 114 - S083 - 01
Other sizes on request.
Low Profile Terminal
Pin-outs
Other pin-outs available on request.
Plating
Standard:
- 01
Despite the very low profile of these sockets the
IC legs can be inserted completely.
tin/gold
Alternative
- 11
- 00
Recommended PCB Layout
Recommended drilling hole dia ∅ 0,8mm/.031“
=
083
=
=
gold/gold
tin/ tin
2.41mm / .095“ over PCB
Specifications
Mechanical data
Insertion force
Extraction force
Contact life
Solderability
Water absorbtion during 24hrs at 20°C
Contact security:
-Vibration (MIL-STD-202 Method 204 B)
-Shock (MIL-STD-202 Method 202 C)
Electrical data
20g
150g
Material
Insulator
Terminal
Contact
Glass filled polyester UL 94 V-O
CuZn
BeCu
Contact resistance at 1A
Current rating
Contact capacitance at 1MHz
Insulation resistance at 500V DC
(MIL-STD-1344 Methode 3003)
Breakdown voltage at 60 Hz
(MIL-STD-1344 Methode 3001.1)
Contact resistance
4,3 mΩ typ.
1A max., 100V
2 pF max.
5 ×109 Ω min.
Operating temperature
1,80 N (avg)
0,90 N (avg)
> 100 cycles
exceeds MIL-STD-202 Methode 208
0,05%
-55° C to +150° C
Pitch
2,54 mm (.100")
500 V AC
≤7 mΩ
17