512MB, 1GB (x72, ECC, DR) 184-Pin DDR SDRAM UDIMM
Features
DDR SDRAM UDIMM
MT18VDDT6472A – 512MB1
MT18VDDT12872A – 1GB
For component data sheets, refer to Micron’s Web site: www.micron.com
Features
Figure 1:
• 184-pin, unbuffered dual in-line memory module
(UDIMM)
• Fast data transfer rates: PC2100, PC2700, or PC3200
• 512MB (64 Meg x 72) and 1GB (128 Meg x 72)
• Supports ECC error detection and correction
• Vdd = VddQ = +2.5V
(-40B: Vdd = VddQ = +2.6V)
• Vddspd = +2.3V to +3.6V
• 2.5V I/O (SSTL_2-compatible)
• Internal, pipelined double data rate (DDR)
2n-prefetch architecture
• Bidirectional data strobe (DQS) transmitted/
received with data—that is, source-synchronous
data capture
• Differential clock inputs (CK and CK#)
• Multiple internal device banks for concurrent
operation
• Dual rank
• Selectable burst lengths (BL): 2, 4, or 8
• Auto precharge option
• Auto refresh and self refresh modes: 7.8125µs
maximum average periodic refresh interval
• Serial presence-detect (SPD) with EEPROM
• Selectable CAS latency (CL) for maximum
compatibility
• Gold edge contacts
Table 1:
184-Pin UDIMM (MO-206 R/C B)
Options
Marking
• Operating temperature2
– Commercial (0°C ≤ TA ≤ +70°C)
None
– Industrial (–40°C ≤ TA ≤ +85°C)
I
• Package
– 184-pin DIMM (standard)
G
– 184-pin DIMM (Pb-free)
Y
• Memory clock, speed, CAS latency
– 5.0ns (200 MHz), 400 MT/s, CL = 3.0
-40B
– 6.0ns (167 MHz), 333 MT/s, CL = 2.5
-335
– 7.5ns (133 MHz), 266 MT/s, CL = 2.01
-262
– 7.5ns (133 MHz), 266 MT/s, CL = 2.01
-26A
– 7.5ns (133 MHz), 266 MT/s, CL = 2.51
-265
1. Not recommended for new designs.
2. Contact Micron for industrial temperature
module offerings.
Key Timing Parameters
Data Rate (MT/s)
tRCD
tRP
tRC
(ns)
(ns)
(ns)
Speed
Grade
Industry
Nomenclature
CL = 3
-40B
PC3200
400
333
266
15
15
55
-335
PC2700
–
333
266
18
18
60
CL = 2.5
CL = 2
-262
PC2100
–
266
266
15
15
PC2100
–
266
266
20
20
65
-265
PC2100
–
266
200
20
20
1
60
-26A
Notes
65
Notes:
PDF: 09005aef80814e61/Source: 09005aef807f8acb
DD18C64_128x72A.fm - Rev. D 9/08 EN
tRCD and tRP
1. The values of
for -335 modules show 18ns to align with industry specifications;
actual DDR SDRAM device specifications are 15ns.
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2004 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
Draft 9/ 9/ 2008
PCB height: 31.75mm (1.25in)
