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部品型式

K9K4G08U0M-PCBT

製品説明
仕様・特性

K9W8G08U1M K9K4G08U0M FLASH MEMORY Document Title 512M x 8 Bit / 1G x 8 Bit NAND Flash Memory Revision History Revision No History Draft Date Remark 0.0 1. Initial issue Feb. 19. 2003 Advance 0.1 1. Add two-K9K4GXXU0M-YCB0/YIB0 Stacked Package Mar. 31. 2003 Preliminary 0.2 1. The 3rd Byte ID after 90h ID read command is don’t cared. The 5th Byte ID after 90h ID read command is deleted. Apr. 9. 2003 Preliminary 0.3 1. The K9W8G16U1M-YCB0,YIB0,PCB0,PIB0 is deleted in line up. 2. Note is added. (VIL can undershoot to -0.4V and VIH can overshoot to VCC +0.4V for durations of 20 ns or less.) 3. Pb-free Package is added. K9K4G08Q0M-PCB0,PIB0 K9K4G08U0M-PCB0,PIB0 K9K4G16U0M-PCB0,PIB0 K9K4G16Q0M-PCB0,PIB0 K9W8G08U1M-PCB0,PIB0 Apr. 30. 2003 Preliminary 0.4 1. Added Addressing method for program operation. Jan. 27. 2004 Preliminary 0.5 1. The tADL(Address to Data Loading Time) is added. - tADL Minimum 100ns - tADL is the time from the WE rising edge of final address cycle to the WE rising edge of first data cycle at program operation. 2. Added addressing method for program operation 3. PKG(TSOP1) Dimension Change May.31. 2004 Preliminary 0.6 1. Technical note is changed 2. Notes of AC timing characteristics are added 3. The description of Copy-back program is changed 4. 1.8V part is deleted Feb. 01. 2005 Preliminary 0.7 1. CE access time : 23ns->35ns (p.11) Feb. 14. 2005 Preliminary 0.8 1. The value of tREA is changed.(18ns->20ns) 2. The value of output load capacitance is changed. 3. EDO mode is added. May 4. 2005 0.9 1. The flow chart to creat the initial invalid block table is changed. May 6. 2005 The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any questions, please contact the SAMSUNG branch office near your office. 1

ブランド

SAMSUNG

会社名

Samsung Electronics Co., Ltd

本社国名

韓国

事業概要

DRAM製品、モバイル機器の製造販売メーカー

供給状況

 
Not pic File
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