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SSM3K127TU

製品説明
仕様・特性

SSM3K127TU TOSHIBA Field-Effect Transistor Silicon N-Channel MOS Type SSM3K127TU ○ Power Management Switch Applications ○ High-Speed Switching Applications Unit: mm 2.1±0.1 • Low ON-resistance: Ron = 286 mΩ (max) (@VGS = 1.8V) 2.0±0.1 : Ron = 167 mΩ (max) (@VGS = 2.5V) : Ron = 123 mΩ (max) (@VGS = 4.0V) 0.65±0.05 1.8V drive +0.1 0.3 -0.05 1.7±0.1 • 1 3 2 Symbol Rating Unit Drain-Source voltage VDSS 30 V Gate-Source voltage VGSS ±12 V DC ID 2.0 Pulse IDP 4.0 PD (Note 1) 800 PD (Note 2) 500 Channel temperature Tch 150 °C Storage temperature range Tstg −55 to 150 °C 0.7±0.05 Characteristic Drain current Drain power dissipation 0.166±0.05 Absolute Maximum Ratings (Ta = 25°C) A UFM 1. Gate 2. Souce 3. Drain mW JEDEC ― JEITA ― TOSHIBA 2-2U1A Note: Using continuously under heavy loads (e.g. the application of high Weight: 6.6mg (typ.) temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Mounted on a ceramic board. 2 (25.4 mm × 25.4 mm × 0.8 t, Cu Pad: 645 mm ) Note 2: Mounted on an FR4 board. 2 (25.4 mm × 25.4 mm × 1.6 t, Cu Pad: 645 mm ) Start of commercial production 2007-04 1 2014-03-01

ブランド

TOSHIBA

会社名

株式会社 東芝セミコンダクター&ストレージ社

本社国名

日本

事業概要

半導体部門、DRAM、フラッシュメモリ、プロセッサ、汎用LSI

供給状況

 
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