Micron Confidential and Proprietary
Advance‡
64Gb, 128Gb, 256Gb, 512Gb Asynchronous/Synchronous
NAND
Features
NAND Flash Memory
Features
• Operation status byte provides software method for
detecting
– Operation completion
– Pass/fail condition
– Write-protect status
• Data strobe (DQS) signals provide a hardware method for synchronizing data DQ in the synchronous
interface
• Copyback operations supported within the plane
from which data is read
• Quality and reliability
– Data retention: JESD47 compliant; see qualification report
– Endurance: 3000 PROGRAM/ERASE cycles
• Operating temperature:
– Commercial: 0°C to +70°C
– Industrial (IT): –40ºC to +85ºC
• Package
– 48-pin TSOP
– 100-ball BGA
• Open NAND Flash Interface (ONFI) 2.3-compliant1
• Multiple-level cell (MLC) technology
• Organization
– Page size x8: 8936 bytes (8192 + 744 bytes)
– Block size: 256 pages (2048K + 186K bytes)
– Plane size: 2 planes x 2048 blocks per plane
– Device size: 64Gb: 4096 blocks;
128Gb: 8192 blocks;
256Gb: 16,384 blocks;
512Gb: 32,786 blocks
• Synchronous I/O performance
– Up to synchronous timing mode 52
– Clock rate: 10ns (DDR)
– Read/write throughput per pin: 200 MT/s
• Asynchronous I/O performance
– Up to asynchronous timing mode 5
– tRC/tWC: 20ns (MIN)
• Array performance
– Read page: 75µs (MAX)
– Program page: 1300µs (TYP)
– Erase block: 3ms (TYP)
• Operating Voltage Range
– VCC: 2.7–3.6V
– VCCQ: 1.7–1.95V, 2.7–3.6V
• Command set: ONFI NAND Flash Protocol
• Advanced Command Set
– Program cache
– Read cache sequential
– Read cache random
– One-time programmable (OTP) mode
– Multi-plane commands
– Multi-LUN operations
– Read unique ID
– Copyback
• First block (block address 00h) is valid when shipped from factory. For minimum required ECC, see
Error Management (page 117).
• RESET (FFh) required as first command after power-on
PDF: 09005aef841b7a46
Rev. E 11/11 EN
Notes:
1
1. The ONFI 2.3 specification is available at
www.onfi.org.
2. BGA devices up to Synchronous timing
mode 5. TSOP devices up to Synchronous
timing mode 4.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2010 Micron Technology, Inc. All rights reserved.
‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
Micron without notice. Products are only warranted by Micron to meet Micron's production data sheet specifications.
Draft: 11/18/11
MT29F64G08CBAB[A/B], MT29F128G08CFABA, MT29F128G08CFABB,
MT29F256G08CJABA, MT29F256G08CJABB, MT29F64G08CBCBB,
MT29F128G08CECBB, MT29F256G08C[K/M]CBB, MT29F512G08CUCBB,
