SB1020CT~SB1060CT
SCHOTTKY BARRIER RECTIFIERS
VOLTAGE
20 to 60 Volts
CURRENT
10 Amperes
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O.
0.419(10.66)
0.387(9.85)
Flame Retardant Epoxy Molding Compound.
0.139(3.55)
MIN.
0.196(5.00)
0.163(4.16)
0.054(1.39)
0.045(1.15)
• Exceeds environmental standards of MIL-S-19500/228
0.624(15.87)
0.548(13.93)
• Low power loss, high efficiency.
• Low forward voltage, high current capability
• High surge capacity.
• For use in low voltage,high frequency inverters
free wheeling , and polarlity protection applications.
0.177(4.5)
MAX.
0.058(1.47)
0.042(1.07)
0.038(0.96)
0.019(0.50)
MECHANCAL DATA
• Case: TO-220AB Molded plastic
• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
0.100(2.54)
0.115(2.92)
0.080(2.03)
0.50(12.7)MIN.
• In compliance with EU RoHS 2002/95/EC directives
0.025(0.65)MAX.
0.100(2.54)
• Polarity: As marked.
• Standard packaging: Any
• Weight: 0.0655 ounces, 1.859 grams.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PA RA ME TE R
S YM B OL S B 1 0 2 0 C T S B 1 0 3 0 C T S B 1 0 4 0 C T S B 1 0 4 5 C T S B 1 0 5 0 C T S B 1 0 6 0 C T
UNITS
Ma xi m um R e c ur re nt P e a k R e ve r s e Vo lta g e
V RRM
20
30
40
45
50
60
V
Ma xi m um R MS Vo lta g e
V RM S
14
21
28
3 1 .5
35
42
V
Ma xi m um D C B lo c k i ng Vo lta g e
V DC
20
30
40
45
50
60
V
Ma xi m um A ve r a g e F o rwa r d C urre nt
.3 7 5 " (9 .5 m m) le a d le ng th a t T C = 7 5 O C
I F ( AV )
10
A
P e a k F o r wa rd S ur g e C ur re nt : 8 .3 ms s i ng le
ha lf s i ne - wa ve s up e r i mp o s e d o n ra te d lo a d
( J E D E C me tho d )
IF S M
150
A
Ma xi m um F o r wa rd Vo lta g e a t 5 A p e r le g
VF
Ma xi m um D C Re ve r s e C urr e nt a t
Ra te d D C B lo c k i ng Vo lta g e
TA = 2 5 OC
TA = 1 0 0 OC
Typ i c a l The rm a l R e s i s ta nce
Op e r a ti ng J unc ti o n a nd S to ra g e Te m p e ra tur e
Ra ng e
0 .5 5
0 .7 5
IR
0 .2
50
R J C
3 .0
T J ,T S TG
- 5 0 to + 1 2 5
V
mA
O
C / W
O
C
NOTE:
Both Bonding and Chip structure are available.
September 2,2010-REV.04
PAGE . 1
