SEAF–20–05.0–S–10–2–A–K–TR
F-217
SEAF–30–05.0–S–08–2–A–K–TR
(1.27 mm) .050"
SEAF SERIES
SEAF–30–05.0–S–08–2–A–LP–K–TR
HIGH-SPEED/HIGH-DENSITY OPEN-PIN-FIELD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Operating Temp Range:
-55 °C to +125 °C
Current Rating
(7 mm stack height):
1.8 A per pin
(10 adjacent pins powered)
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Contact Resistance:
5.5 mW
Working Voltage:
240 VAC
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
Up to
500 pins
(1.15 mm)
.045"
NOMINAL
WIPE
Board Mates:
SEAM, SEAMP,
SEAR, SEAMI
5, 8 and 10 row footprint
compatible with SamArray®.
Samples recommended.
Cable Mates:
SEAC
Standoffs:
JSO
10 YEAR MFG
WITH 30 µ" GOLD
Low
insertion/
extraction
forces
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
Solder
charges
HIGH-SPEED CHANNEL PERFORMANCE
34
SEAF/SEAM @ 10 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
G b p s
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
NO. PINS
PER ROW
LEAD
STYLE
–10, –15, – 20,
– 30, –40, –50
Specify
LEAD
STYLE
from
chart
SEAF
FILE NO. E111594
STANDARDS
• PISMO 2
• VITA 47
• VITA 57.1
PROTOCOLS
• 100 GbE
• Fibre Channel
• Rapid I/O
• PCI Express®
• SATA
• InfiniBand™
MATED HEIGHTS
SEAM SEAF LEAD STYLE
LEAD
STYLE –05.0 –06.0 –06.5
8 mm 8.5 mm
–02.0 7 mm
9 mm 9.5 mm
–03.0 8 mm
–03.5 8.5 mm 9.5 mm 10 mm
–06.5 11.5 mm 12.5 mm 13 mm
–07.0 12 mm 13 mm 13.5 mm
–09.0 14 mm 15 mm 15.5 mm
–11.0 16 mm 17 mm 17.5 mm
Notes:
Patented
IPC-A-610F and
IPC J-STD-001F Class 3
solder joint.
Some sizes, styles and
options are non-standard,
non-returnable.
(–10 only available
in 04 row)
(–15 only available
in 04 or 10 row with
–05.0 lead style)
NO. OF
B
ROWS
(5.66) .223
–04
–05, –06 (8.20) .323
(10.74) .423
–08
(13.28) .523
–10
(1.27) .050
LEAD
STYLE
A
–05.0 (5.05)
.199
–06.0
(6.05)
.238
–06.5 (6.55)
.258
PLATING
OPTION
NO. OF
ROWS
–L
– 04
= 10 µ"
(0.25 µm)
Gold on
contact
area,
Matte Tin on
solder tail
=Four
Rows
SOLDER
TYPE
A
–1
– 05
– 06
–S
TR
–K
= Polyimide
= Latch Post
film Pick &
(–LP required
Place Pad
for SEAC
(Not
mate only)
available
(Available with
with –10 and
–05.0 lead style
–15 pins
and –04, –06, –08
with –LP
& –10 rows only) Latch post)
= Lead-Free
Solder Charge
=Six
Rows
= 30 µ"
(0.76 µm)
Gold on
contact
area,
Matte Tin on
solder tail
K
– LP
= Tin/Lead
Alloy
Solder Charge
=Five
Rows
OPTION
–2
– 08
=Eight
Rows
ALSO AVAILABLE
– 10
• Polarization pin
Contact Samtec.
(MOQ Required)
=Ten
Rows
08
DIFFERENTIAL
(1.27)
.050
B
(1.27) .050
ARRAY
(1.27)
.050
No. of positions x 01
(1.27) .050 + (5.82) .229
(1.27)
.050
(15.49)
.610
(1.78)
.070
A
(1.12) .044 DIA
No. of positions x
(1.27) .050 + (3.58) .141
(0.20)
.008
–LP
ARRAY
50x10
50x8
40x10
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
PAIR
COUNT
125
100
100
40x8
40x6
30x10
30x8
30x6
20x10
20x8
20x5
PAIR
COUNT
80
60
75
60
45
50
40
25
