Multilayer Chip Inductors
For High-frequency Circuits
And Modules,
MLK0603 series
Conforming to RoHS Directive
Conformity to RoHS Directive: This means that, in conformity with
EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent
chromium, and specific bromine-based flame retardants, PBB
and PBDE, have not been used, except for exempted applications.
The 0603 type - the smallest in the industry, and the most advanced in the
MLK series, with numerous achievements in its use as a high Q element
optimal for signal-processing circuits in the 1-2GHz band in mobile communication devices such as RF amplifiers, mixers, VCO, PLL synthesizers - is
available in 19 varieties covering 1-33nH, responding to the cutting-edge
design needs of small digital devices.
Shapes and dimensions
Recommende PC board pattern
C
0.3 0.03
(Reflow process)
0.6 0.03
B
0.15 0.05
0.2 min.
Gigaspira TM multilayer structure
Original GHz-band-ready structure
overcoming the limitations of the
conventional structures.
A
B
A : 0.25 to 0.35
B : 0.2 to 0.3
C: 0.25 to 0.35
0.65 to 0.95
0.3 0.03
With further fine-tuned super-fine lamination
technology, allowing no misalignment - even
of micron-order, mass-production technology
of condensed "Gigaspira TM Multilayer structure", of greater precision than ever, inside
the super-small 0603 chip where the area of
internal conductor pattern can be reduced
to 1/3 of the 1005 type, has been established.
Dimensions in mm
Weight : 0.2 mg
Dimensions in mm
Recommended soldering conditions
Lead-free solder/High-temperature reflow process
240 to 250 °C
230 °C
Cutting-edge hyper specifications and outstanding circuit condensation effects are
offered too - not to mention diverse modules
for mobile telephones of the next generation;
small device RF modules such as DVC, digital
still cameras, and PDA devices; and CCD
modules, as well as downsizing the design of
Bluetooth modules integrated in those devices.
TDK CORPORATION
Slow cooling
180 °C
30 s max.
150 °C
Preheating : 60 to 120 s
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MLK0603
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