GE
Data Sheet
TitaniaTM Power Modules
20A ZephyrTM: Non-Isolated DC-DC Power Modules
5Vdc –12Vdc input; 0.8Vdc to 3.5Vdc output; 20A Output Current
RoHS Compliant
Features
The Zephyr Power Module provides precise voltage
and very fast transient response in the industry’s
smallest footprint while offering very high reliability
and high efficiency.
Applications
Workstations
Servers
Desktop computers
Data processing applications
Distributed power architectures
Telecommunications equipment
LAN/WAN applications
Compliant to RoHS EU Directive 2002/95/EC (-Z version)
Compliant to ROHS EU Directive 2002/95/EC with lead
solder exemption (non-Z versions)
Transient response met from 0A to rated full load (up to
600 A/S)
Exceeds VRM 8.x load transient requirements
No external bulk output capacitors required for transient
response
Wide input range 4.5V to 12.6V
Wide output range 0.8V to 3.5V
Operation down to zero airflow
Small size and very low profile
Small size: ideal for minimizing motherboard area in
multiprocessor/multi-chip applications
High reliability: 200 FITs/5 million hour MTBF
Surface mount design shipped in JEDEC tray
Single control pin for margining
Single pin for output voltage setting
High efficiency
89% typical @ 16A, VIN = 5V, VOUT = 3.3V
88% typical @ 18A, VIN = 5V, VOUT = 2.5V
83% typical @ 20A, VIN = 5V, VOUT = 1.5V
75% typical @ 20A, VIN = 5V, VOUT = 0.8V
Remote sense
Programmable output voltage via resistor or voltage
source
Voltage trim capability using resistor
Output enable and module OK signals
Output overvoltage, overcurrent, short circuit, and
thermal protection
No heat sink required
Low inductance surface-mount connections
UL* 1950 Recognized, CSA† C22.2 No. 950-95 Certified,
and VDE 0805 (EN60950, IEC950) Licensed. CE mark
meets 73/23/EEC and 93/68/EEC directives ‡
Dimensions: 52.32 mm x 37.08 mm x 5.66 mm (2.06 in. x
1.460 in. x 0.223 in.)
Total weight: 15.5g (0.55 oz.)
Description
The Zephyr Power Module is designed to meet the precise voltage and fast transient requirements of today’s and
tomorrow’s high performance microprocessor, DSP, memory boards and system level applications in a distributed power
architecture. Advanced circuit techniques, high-frequency switching, custom passive and active components, and very
high-density, surface-mount packaging technology deliver high-quality, ultra compact, non-isolated DC-DC conversion.
* UL is a registered trademark of Underwriters Laboratories, Inc.
†
‡
CSA is a registered trademark of Canadian Standards Association.
This product is intended for integration into end-use equipment. All the required procedures for CE marking of end-use equipment should be followed
June 12, 2015
©2015 General Electric Company. All rights reserved.
