MMBZ5221B - MMBZ5259B
SENSITRON
SEMICONDUCTOR
350mW SURFACE MOUNT ZENER DIODE
Data Sheet 2675, Rev. -
Features
·
·
·
·
Planar Die Construction
350mW Power Dissipation on FR-4 PCB
General Purpose, Medium Current
A
Ideally Suited for Automated Assembly
Processes
Mechanical Data
·
·
·
Case: SOT-23, Molded Plastic
Terminals: Solderable per MIL-STD-202,
Method 208
Polarity: See Diagram
Marking: Marking Code (See Table on Page 2)
Weight: 0.008 grams (approx.)
E
G
D
Forward Voltage
@ IF = 10mA
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Notes:
1.40
2.10
2.50
0.89
1.05
0.45
0.61
G
2.05
2.65
3.05
0.013
0.15
0.89
1.10
L
0.45
0.61
M
L
J
K
M
K
J
1.78
H
H
Maximum Ratings @ TA = 25°C unless otherwise specified
Characteristic
Symbol
0.51
1.19
C
TOP VIEW
Max
0.37
B
C
Min
A
E
B
Dim
D
·
·
SOT-23
0.076
0.178
All Dimensions in mm
Value
Unit
VF
0.9
V
Pd
350
mW
RqJA
357
K/W
Tj, TSTG
-65 to +150
°C
1. Valid provided that device terminals are kept at ambient temperature.
2. Tested with pulses, Tp £ 1.0ms.
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