1SMA59xxBT3G Series,
SZ1SMA59xxBT3G Series
1.5 Watt Plastic
Surface Mount
Zener Voltage Regulators
www.onsemi.com
This complete new line of 1.5 Watt Zener Diodes offers the
following advantages.
Features
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Standard Zener Breakdown Voltage Range − 3.3 V to 68 V
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Flat Handling Surface for Accurate Placement
Package Design for Top Slide or Bottom Circuit Board Mounting
Low Profile Package
Ideal Replacement for MELF Packages
AEC−Q101 Qualified and PPAP Capable − SZ1SMA59xxBT3G
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These are Pb−Free Devices*
SMA
CASE 403D
STYLE 1
CATHODE
ANODE
MARKING DIAGRAM
8xxB
AYWWG
Mechanical Characteristics:
CASE: Void-free, transfer-molded plastic
FINISH: All external surfaces are corrosion resistant with readily
solderable leads
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 seconds
POLARITY: Cathode indicated by molded polarity notch or cathode
band
FLAMMABILITY RATING: UL 94 V−0 @ 0.125 in
8xxB
A
Y
WW
G
= Device Code (Refer to page 2)
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
MAXIMUM RATINGS
Rating
DC Power Dissipation @ TL = 75°C,
Measured Zero Lead Length (Note 1)
Derate above 75°C
Thermal Resistance, Junction−to−Lead
Package
Shipping†
1SMA59xxBT3G
SMA
(Pb−Free)
5,000 /
Tape & Reel
SZ1SMA59xxBT3G
SMA
(Pb−Free)
5,000 /
Tape & Reel
Device
Symbol
Value
Unit
1.5
20
50
W
mW/°C
°C/W
0.5
4.0
250
W
mW/°C
°C/W
−65 to
+150
°C
PD
RqJL
DC Power Dissipation @ TA = 25°C (Note 2)
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
PD
RqJA
Operating and Storage Temperature Range
TJ, Tstg
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. 1 in square copper pad, FR−4 board.
2. FR−4 Board, using ON Semiconductor minimum recommended footprint.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2016
April, 2016 − Rev. 9
1
Publication Order Number:
1SMA5913BT3/D
