R8C/22 Group, R8C/23 Group
RENESAS MCU
1.
REJ03B0097-0200
Rev.2.00
Aug 20, 2008
Overview
This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged
in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of
instruction efficiency. With 1 Mbyte of address space, it is capable of executing instructions at high speed. This MCU
is equipped with one CAN module and suited to in-vehicle or FA networking.
Furthermore, the data flash (1 KB x 2 blocks) is embedded in the R8C/23 Group.
The difference between R8C/22 and R8C/23 Groups is only the existence of the data flash. Their peripheral functions
are the same.
1.1
Applications
Automotive, etc.
Rev.2.00 Aug 20, 2008
REJ03B0097-0200
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