IS25C32A
IS25C64A
32K-BIT/64K-BIT SPI SERIAL
ELECTRICALLY ERASABLE PROM
AUGUST 2007
FEATURES
DESCRIPTION
• Serial Peripheral Interface (SPI) Compatible
— Supports SPI Modes 0 (0,0) and 3 (1,1)
• Wide-voltage Operation
— Vcc = 1.8V to 5.5V
• Low power CMOS
— Active current less than 3.0 mA (2.5V)
— Standby current less than 2.0 µA (2.5V)
• Block Write Protection
— Protect 1/4, 1/2, or Entire Array
• 32 byte page write mode
— Partial page writes allowed
• 10 MHz Clock Rate (5V)
• Self timed write cycles (5 ms Typical)
• High-reliability
— Endurance: 1 million cycles per byte
— Data retention: 100 years
• Industrial and Automotive temperature ranges
• 8-pin PDIP, 8-pin SOIC, and 8-pin TSSOP Packages
available
• Lead-free available
The IS25C32A and IS25C64A are electrically erasable
PROM devices that use the Serial Peripheral Interface
(SPI) for communications. The IS25C32A is 32Kbit
(4096 x 8) and the IS25C64A is 64Kbit (8192 x 8). The
IS25C32A/64A EEPROMs are offered in a wide
operating voltage range of 1.8V to 5.5V to be compatible
with most application voltages. ISSI designed the
IS25C32A/64A to be an efficient SPI EEPROM solution.
The devices are packaged in 8-pin PDIP, 8-pin SOIC,
and 8-pin TSSOP.
The functional features of the IS25C32A/64A allow them
to be among the most advanced serial non-volatile
memories available. Each device has a Chip-Select
(CS) pin, and a 3-wire interface of Serial Data In (SI),
Serial Data Out (SO), and Serial Clock (SCK). While
the 3-wire interface of the IS25C32A/64A provides for
high-speed access, a HOLD pin allows the memories to
ignore the interface in a suspended state; later the
HOLD pin re-activates communication without reinitializing the serial sequence. A Status Register
facilitates a flexible write protection mechanism, and a
device-ready bit (RDY).
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc.
Rev. A
08/14/07
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