16GB (ECC, QR) 204-Pin 3DS M/S DDR3L SO-EDIMM
Features
3DS Master-Slave 1.35V DDR3L
SO-EDIMM
MT36KSS2G72HSZ – 16GB
Features
Figure 1: 204-Pin SODIMM (MO-268)
• 3DS master-slave DDR3L functionality and
operations supported as defined in the 3DS DDR3L
component data sheet
• 204-pin, small outline dual in-line memory module
with ECC (SO-EDIMM)
• Fast data transfer rates: PC3-12800, PC3-10600,
PC3-8500, or PC3-6400
• 16GB (2 Gig x 72)
• VDD = 1.35V (1.283–1.45V)
• VDD = 1.5V (1.425–1.575V)
• Backward compatible to V DD = 1.5V ±0.075V
• VDDSPD = 3.0–3.6V
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Quad rank, using two ranks of 3DS Mater-Slave devices
• On-board I2C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Module Height: 30mm (1.181 in)
Options
Marking
• Operating temperature
– Commercial (0°C ≤ T A ≤ +70°C)
• Package
– 204-pin DIMM (halogen-free)
• Frequency/CAS latency
– 1.25ns @ CL = 12 (DDR3-1600)
– 1.5ns @ CL = 10 (DDR3-1333)
None
Z
-1S6
-1S4
Table 1: Key Timing Parameters
Data Rate (MT/s)
Speed
Grade
Industry
Nomenclature
CL =
12
CL =
11
CL =
10
(ns)
(ns)
(ns)
-1S6
PC3-12800
1600
–
1333
–
1066
–
–
–
13.5
13.5
48.125
-1S4
PC3-10600
–
–
1333
1066
1066
800
–
–
13.5
13.5
49.125
PDF: 09005aef84c08183
kss36c2gx72hsz.pdf - Rev. A 05/12 EN
tRCD
CL = 9 CL = 8 CL = 7 CL = 6 CL = 5
1
tRP
tRC
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
