Leadless Chip LED
GM1❏❏55200A series
1608 Size, 0.55mm Thickness,
Thin Type Leadless Chip LED
GM1❏❏55200A series
I Outline Dimensions
(Unit : mm)
I Directive Characteristics
-20˚
1.6±0.15
-40˚
0.55
Relative luminous intensity(%)
0.8±0.15
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1
-60˚
Recommended PWB pattern for soldering
Device center
-80˚
0.8
1.2
0.8
Epoxy resin
-20˚
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PWB
Relative luminous intensity(%)
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(0.3)
20
0˚
-40˚
(0.3)
1
+60˚
40
+80˚
2
-60˚
The longer side from emitting
portin is Anode. The shorter
side is Cathode.
3.Unspecified tolerance:±0.1
Chip side mark
+20˚
100
1Cathode
2Anode
(0.3)
60
X
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1.Plating area
Resist
2.Pin connections
+40˚
80
0
0.8
0.18
1.0
0.9
+20˚
100
(0.2)
2
Emission center
0˚
(Ta=25˚C)
-80˚
+40˚
80
60
+60˚
40
20
+80˚
0
Y
I Absolute Maximum Ratings
Model No. Emitting color
Material
(Ta=25˚C)
Power dissipation Forward current Peak forward current
P
IF
IFM*1
(mW)
(mA)
(mA)
Derating factor Reverse voltage Operating temperature Storage temperature Soldering temperature
(mA/˚C)
VR
Topr
Tstg
Tsol*2
(V)
(˚C)
(˚C)
(˚C)
DC Pulse
GaAsP on GaP
84
30
50
0.40 0.67
5
GM1HD55200A Red
GaAsP on GaP
84
30
50
0.40 0.67
5
GM1HY55200A Yellow
84
30
50
0.40 0.67
5
GM1HS55200A Sunset-orange GaAsP on GaP
GM1EG55200A Yellow-green GaP
84
30
50
0.40 0.67
5
*1 Duty ratio=1/10, Pulse width=0.1ms
*2 For 3s or less at the temperature of hand soldering. Temperature of reflow soldering is shown on page 2.
-30 to +85
-30 to +85
-30 to +85
-30 to +85
I Electro-optical Characteristics
Lens type
Model No.
Forward voltage
VF(V)
TYP
GM1HD55200A
Colorless GM1HY55200A
transparency GM1HS55200A
GM1EG55200A
24
Notice
Internet
MAX
2.0
2.1
2.0
2.1
2.8
2.8
2.8
2.8
-40 to +100
-40 to +100
-40 to +100
-40 to +100
350
350
350
350
(IF=20mA,Ta=25˚C)
Peak emission
wavelength
λp(nm)
TYP
635
585
610
565
Luminous
intensity
IV(mcd)
TYP
12.5
11.5
11.4
19.0
Spectrum radiation
bandwidth
∆λ(nm)
TYP
35
30
35
30
VR
(V)
Ct(pF)
TYP
(MHZ)
Page for
characteristics
diagrams
4
4
4
4
20
35
35
35
1
1
1
1
47
48
48
49
Reverse current
IR(µA)
MAX
10
10
10
10
Terminal capacitance
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet address for Electronic Components Group http://sharp-world.com/ecg/
