R8C/18 Group, R8C/19 Group
SINGLE-CHIP 16-BIT CMOS MCU
1.
REJ03B0124-0140
Rev.1.40
Apr 14, 2006
Overview
These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the
R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic
molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1
Mbyte of address space, they are capable of executing instructions at high speed.
Furthermore, the R8C/19 Group has on-chip data flash ROM (1 KB × 2 blocks).
The difference between the R8C/18 Group and R8C/19 Group is only the presence or absence of data
flash ROM. Their peripheral functions are the same.
1.1
Applications
Electric household appliances, office equipment, housing equipment (sensors, security systems), general
industrial equipment, audio equipment, etc.
Rev.1.40 Apr 14, 2006
REJ03B0124-0140
Page 1 of 38
